Polishing pad finishing device

A dressing device, polishing pad technology, applied in abrasive surface conditioning devices, grinding/polishing equipment, parts of grinding machine tools, etc., can solve the problems of influence, difficult continuous dressing of grinding pads, poor process reproducibility and dispersion, etc. , to achieve the effect of improving uniformity, ensuring reproducibility and dispersion, and improving reproducibility and dispersion

Inactive Publication Date: 2020-08-25
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] In the prior art, the size of the dressing disc is significantly smaller than the size of the polishing pad and the grinding head, and it is difficult to achieve continuous dressing of the polishing pad during the dressing process of the polishing pad, which is likely to cause adverse effects on the reproducibility and dispersion of the process

Method used

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  • Polishing pad finishing device
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specific Embodiment approach

[0034] Install four trimming discs on the adjusting arm, the sum of the diameters of the four trimming discs is equal to or slightly smaller than the radius of the grinding pad, and the four trimming discs are arranged linearly on the adjusting arm, so that when the adjusting arm When pointed at the center of the pad, the four conditioning discs completely cover one radius of the pad.

[0035] The four trimming discs are driven and connected to the four rotating drive mechanisms one by one, and the rotating drive mechanism can use a motor, so that each motor drives a trimming disc to rotate, and the four trimming discs are driven by four motors, and each motor is designed By setting different rotation parameters, each dressing disc can be driven to rotate with different rotation parameters.

[0036]The four trimming discs are driven and connected to the four gas pressurizing mechanisms one by one. The gas pressurizing mechanism can use pneumatic diaphragms. In this way, each p...

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Abstract

The invention provides a polishing pad finishing device which comprises an adjusting arm and two or more finishing plates connected to the adjusting arm. The two or more finishing plates are separately used for finishing surfaces of different areas of the polishing pad. The polishing pad finishing device finishes the surface of different areas of the polishing pad by using the polishing plates andcan finish the surface of the whole polishing pad continuously, so that the reproducibility and the dispersity of a process are improved and the service period of the polishing pad can be prolonged.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a polishing pad dressing device. Background technique [0002] During the grinding process of semiconductor devices, the polishing pad will gradually become smooth after grinding a certain number of semiconductor devices. If the grinding is continued in this state, the process characteristics of semiconductor devices will be affected. In order to make the polishing pad have a state similar to the initial state, it is necessary to use a dressing disc to repair the surface of the polishing pad, so that the surface of the polishing pad becomes rough again. The process of repairing the surface of the polishing pad is called the dressing process of the polishing pad. [0003] In the prior art, the size of the dressing disc is significantly smaller than the size of the grinding pad and the grinding head, and it is difficult to achieve continuous dressing of the g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/017B24B53/02B24B53/14
CPCB24B53/017B24B53/02B24B53/14
Inventor 丁彦荣杨涛张月卢一泓刘青
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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