Substrate bending shape measuring method and device, storage medium and terminal
A measurement method and measurement device technology, applied in image data processing, instruments, calculations, etc., can solve the problems of manual re-inspection, unfavorable mass production, time-consuming, etc., and achieve the effect of saving labor costs, saving time, and simple implementation process
Active Publication Date: 2020-08-28
FUJIAN JING AN OPTOELECTRONICS CO LTD
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Problems solved by technology
However, the surface scanning method is time-consuming, and usually requires manual re-inspection, which is time-consuming and labor-intensive, which is not conducive to mass production
Method used
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Embodiment 1
[0077] The preparation of the substrate is a very important link in the manufacturing process of semiconductor devices, and the yield of the substrate directly affects the performance of the device. Since the substrate is usually a very thin sheet, there is inevitably bending, and the description of the curved shape of the substrate has always been a difficult problem in the industry.
[0078] Such as Figure 1a ~ Figure 1d As shown, several common bending types of substrate bending are shown. in Figure 1a It is shown that the substrate is scanned in X and Y directions. The scanning results show that the bending direction of the substrate in the two opposite directions of X and Y is also opposite. For example, the substrate is bent upward in the X direction, while in the Y direction The upper substrate is bent downward, and the substrate presents a shape similar to a saddle, so such a curved type is usually called a saddle type; Figure 1b It is shown as a line scan of the ...
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The invention provides a substrate bending shape measuring method and device, a storage medium and a terminal. According to the method, line scanning is performed on the surface of a substrate in different directions to obtain scanning curves, curve fitting is performed on the scanning curves in different directions to obtain fitting curves, the bending angles of the fitting curves are obtained according to the average curvature and arc length of the fitting curves, and the bending type of the substrate is measured and judged according to the bending angles. For a substrate with a complex bending curve, the method can guarantee the accuracy of a measurement result. Besides, the method adopts a line scanning method, the whole process does not need manual judgment, more time and labor cost are saved, mass production of substrate bending shape measurement is facilitated, and meanwhile, the accuracy of a measurement result can be ensured. The measuring device, the storage medium and the terminal provided by the invention can execute the method provided by the invention, so that the technical effects are also achieved.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method, device, storage medium and terminal for measuring the curved shape of a substrate. Background technique [0002] In the manufacturing process of semiconductor devices, the manufacture of various substrates is an important link. During the machining process of the substrate, affected by various factors, the surface of the substrate is prone to convex or concave shapes. For example, in a commonly used sapphire substrate, in a polished sapphire substrate, warping or bending usually occurs on the substrate due to residual processing deformation or a difference in surface roughness between upper and lower surfaces after finishing. For example, in a substrate polished on one side, the difference in surface roughness between the upper and lower surfaces becomes the main cause of warping or bending; Slight deviations in surface roughness within the bottom f...
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Login to View More IPC IPC(8): G06T7/60G06T7/66
CPCG06T7/60G06T7/66G06T2207/10004G06T2207/30148
Inventor 李瑞评曾柏翔张佳浩陈铭欣
Owner FUJIAN JING AN OPTOELECTRONICS CO LTD