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Terahertz diode circuit assembly board and preparation method thereof

A diode, terahertz technology, applied in the terahertz field, can solve the problems of difficult positioning and easy movement, and achieve the effect of stable circuit performance and easy positioning

Active Publication Date: 2020-08-28
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the embodiment of the present invention provides a terahertz diode circuit assembly board and its preparation method to solve the problems of difficult positioning and easy movement in the assembly of terahertz diode die chips in the prior art

Method used

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  • Terahertz diode circuit assembly board and preparation method thereof
  • Terahertz diode circuit assembly board and preparation method thereof
  • Terahertz diode circuit assembly board and preparation method thereof

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Embodiment Construction

[0029] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0030] In order to illustrate the technical solutions of the present invention, specific examples are used below to illustrate.

[0031] see figure 1 with figure 2 A terahertz diode circuit assembly board includes a circuit substrate for assembling terahertz diodes, and further includes: a plurality of terahertz diode positioning posts.

[0032] Wherein, a plurality of terahertz diode position...

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Abstract

The invention is applicable to the technical field of terahertz, and provides a terahertz diode circuit assembly board and a preparation method thereof. The terahertz diode circuit assembly board comprises a circuit substrate used for assembling a terahertz diode, and also comprises a plurality of terahertz diode positioning piles, wherein the plurality of terahertz diode positioning piles are arranged on the circuit substrate, located on two sides of a preset position of the terahertz diode of the circuit substrate and used for fixing the terahertz diode. According to the invention, the plurality of terahertz diode positioning piles located on the two sides of the preset position of the terahertz diode of the circuit substrate are arranged on the circuit substrate used for assembling theterahertz diode, so that the positioning of the assembly position of the terahertz diode is facilitated, the terahertz diode can be accurately and firmly fixed to the circuit substrate, and the stability of the performance of a final circuit formed by assembling the terahertz diode is facilitated.

Description

technical field [0001] The invention belongs to the technical field of terahertz, and in particular relates to a terahertz diode circuit assembly board and a preparation method thereof. Background technique [0002] 0.1THz-10THz is usually called the terahertz frequency band. The chip size of this frequency band is small and the assembly is difficult. Especially in the circuit assembly of a terahertz frequency multiplier or mixer with a flip-chip structure, how to accurately and firmly fix the terahertz diode die on the circuit substrate is a part of the terahertz frequency multiplier or mixer circuit assembly. The process is difficult. [0003] In the existing process, the terahertz diode die chip is only connected to the pad by solder, so positioning is difficult, and the die is prone to move during subsequent process operations, which affects the performance of the final circuit. Contents of the invention [0004] In view of this, an embodiment of the present inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/67144H01L21/68764
Inventor 宋旭波梁士雄吕元杰张立森冯志红顾国栋郭红雨
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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