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Chip superheated water-cooling heat dissipation equipment

A water-cooled heat dissipation and overheating technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of high heat dissipation, large amount of calculation, overheating, etc., and achieve a high degree of integration, easy operation, and simple structure.

Active Publication Date: 2020-08-28
山东永通汽车配件有限公司
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Problems solved by technology

[0002] As we all know, the chip is the heart of smart devices, and its importance is self-evident. However, when the chip is used, due to its large amount of calculation, it often causes overheating. Now the market is equipped with air-cooled and water-cooled, or two However, the combination of the two consumes more power, so it is necessary to design a chip superheated cooling device to solve the above problems

Method used

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  • Chip superheated water-cooling heat dissipation equipment
  • Chip superheated water-cooling heat dissipation equipment
  • Chip superheated water-cooling heat dissipation equipment

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Embodiment Construction

[0016] Combine below Figure 1-5 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0017] combined with Figure 1-5 The chip superheated water cooling and heat dissipation equipment includes a cooling box 10, a transmission cavity 15 is arranged in the cooling box 10, a horizontal shaft 18 is arranged on the inner wall of the rear side of the transmission cavity 15, and a horizontal shaft 18 is fixed on the horizontal shaft 18. A fan blade 20 is provided, and a hot water output groove 16 is formed through the inner wall on the upper side of the transmission chamber 15, and a hot water input groove 30 is formed through the inner wall on the left side of the transmission chamber 15. A cold water input tank 17 is provided through the left and right sides, and a cold wat...

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Abstract

The invention discloses chip superheated water-cooling heat dissipation equipment, which comprises a cooling box, wherein the cooling box is internally provided with a conveying cavity, a transverse shaft is rotationally arranged on the inner wall of the rear side of the conveying cavity, fan blades are fixedly arranged on the transverse shaft, a hot water output tank is vertically formed in the inner wall of the upper side of the conveying cavity, and a hot water input tank is formed in the left inner wall of the conveying cavity in a left-right penetrating mode. The equipment is simple in structure, and simple and convenient to operate. The equipment is cooled by air cooling in general, but when the heat of a chip cannot be cooled under the air cooling condition, the equipment can automatically open water cooling to cool the equipment, and when the equipment carries out heat dissipation by air cooling, the exhaust angle of air cooling can be increased. The equipment is complete in function cooperation, and has a high integration degree.

Description

technical field [0001] The invention relates to the field of chip heat dissipation, in particular to a chip overheating water cooling and heat dissipation device. Background technique [0002] As we all know, the chip is the heart of smart devices, and its importance is self-evident. However, when the chip is used, due to its large amount of calculation, it often causes overheating. Now the market is equipped with air-cooled and water-cooled, or two The combination of the two is used to dissipate heat, but the combination of the two consumes more power. Therefore, it is necessary to design a chip overheating water cooling device to solve the above problems. Contents of the invention [0003] The object of the present invention is to provide a chip overheating water cooling and cooling device for overcoming the above-mentioned defects in the prior art. [0004] The present invention is achieved through the following technical solutions. [0005] A chip superheated water c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/473H01L23/467
CPCH01L23/367H01L23/467H01L23/473
Inventor 李梦霞
Owner 山东永通汽车配件有限公司
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