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A kind of chip overheating water cooling and cooling equipment

A water-cooled heat dissipation and overheating technology, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as overheating, heat dissipation, high power consumption, and large calculation volume, and achieves a high degree of integration, easy operation, and The effect of simple structure

Active Publication Date: 2020-11-13
山东永通汽车配件有限公司
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  • Application Information

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Problems solved by technology

[0002] As we all know, the chip is the heart of smart devices, and its importance is self-evident. However, when the chip is used, due to its large amount of calculation, it often causes overheating. Now the market is equipped with air-cooled and water-cooled, or two However, the combination of the two consumes more power, so it is necessary to design a chip superheated cooling device to solve the above problems

Method used

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  • A kind of chip overheating water cooling and cooling equipment
  • A kind of chip overheating water cooling and cooling equipment
  • A kind of chip overheating water cooling and cooling equipment

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Embodiment Construction

[0017] Combine below Figure 1-5 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0018] combined with Figure 1-5 The chip superheated water cooling and heat dissipation equipment includes a cooling box 10, a transmission cavity 15 is arranged in the cooling box 10, a horizontal shaft 18 is arranged on the inner wall of the rear side of the transmission cavity 15, and a horizontal shaft 18 is fixed on the horizontal shaft 18. A fan blade 20 is provided, and a hot water output groove 16 is formed through the inner wall on the upper side of the transmission chamber 15, and a hot water input groove 30 is formed through the inner wall on the left side of the transmission chamber 15. A cold water input tank 17 is provided through the left and right sides, and a cold wat...

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Abstract

The invention discloses a chip superheated water cooling and heat dissipation device, which includes a cooling box, a transmission cavity is arranged in the cooling box, a horizontal axis is arranged on the inner wall of the rear side of the transmission cavity, and fan blades are fixed on the horizontal axis. The inner wall on the upper side of the transmission chamber is provided with hot water output grooves through the upper and lower sides, and the inner wall on the left side of the transmission chamber is provided with hot water input grooves through the left and right sides. The present invention is simple in structure and easy to operate. The heat is dissipated by air cooling, but when the heat of the chip cannot be cooled under the condition of air cooling, the device will automatically turn on the water cooling to dissipate heat from the device. When the device is cooling by air, the device will increase the exhaust angle of the air cooling , The function of the equipment is well coordinated and has a high degree of integration.

Description

technical field [0001] The invention relates to the field of chip heat dissipation, in particular to a chip overheating water cooling and heat dissipation device. Background technique [0002] As we all know, the chip is the heart of smart devices, and its importance is self-evident. However, when the chip is used, due to its large amount of calculation, it often causes overheating. Now the market is equipped with air-cooled and water-cooled, or two The combination of the two is used to dissipate heat, but the combination of the two consumes more power. Therefore, it is necessary to design a chip overheating water cooling device to solve the above problems. Contents of the invention [0003] The object of the present invention is to provide a chip overheating water cooling and cooling device for overcoming the above-mentioned defects in the prior art. [0004] The present invention is achieved through the following technical solutions. [0005] A chip superheated water c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/473H01L23/467
CPCH01L23/367H01L23/467H01L23/473
Inventor 李梦霞
Owner 山东永通汽车配件有限公司
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