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Ceramic leadless chip packaging structure

A packaging structure, leadless technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as performance degradation, achieve the effect of increasing density, reducing packaging process steps, and realizing miniaturization

Active Publication Date: 2020-08-28
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a ceramic leadless chip package structure, aiming at solving the performance degradation in high-speed and high-frequency applications due to the use of bonding wires for the connection of chips and shell bonding fingers in the prior art technical issues

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  • Ceramic leadless chip packaging structure
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Embodiment Construction

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0042] Please also refer to Figure 1 to Figure 14 , the structure of the ceramic leadless chip package provided by the present invention will now be described. The ceramic leadless chip package structure includes a ceramic substrate 1, a chip 2, a lead-out terminal and a cover plate 3; the ceramic substrate 1 is provided with a first pad 4, and the back of the chip 2 is provided with a pad corresponding to the first pad 4. The second pad is used to weld the first pad 4 through the solder ball 5 after the solder ball 5 is implanted. The first pad 4 is conductivel...

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Abstract

The invention provides a ceramic leadless chip packaging structure, and belongs to the technical field of chip packaging. The structure comprises a ceramic substrate, a chip, a leading-out end and a cover plate, wherein the ceramic substrate is provided with a first bonding pad, the back surface of the chip is provided with a second bonding pad corresponding to the first bonding pad, the second bonding pad is used for being welded with the first bonding pad through a solder ball after the solder ball is implanted, the leading-out end is arranged at the lower portion of the ceramic substrate and is conductively connected with the first bonding pad through a conductive structure in the ceramic substrate, and the cover plate hermetically covers the periphery of the chip. According to the ceramic leadless chip package structure provided by the invention, bonding by using a bonding wire is avoided, so that the problem of performance reduction in a high-frequency and high-speed application scene caused by the bonding wire is avoided, the package process steps are reduced, and the ceramic leadless chip package structure has good electrical performance and reliability; the size of the ceramic substrate is effectively reduced, so that miniaturization of packaging is facilitated; and the bonding interconnection mode is changed into the inverted bump interconnection mode, so that the interconnection density is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, and more specifically relates to a ceramic leadless chip package structure. Background technique [0002] Ceramic leadless chip housing is a miniaturized mounting housing. Compared with other packaging forms, due to its small size, light weight, and outstanding electrical and thermal properties, this packaging form is suitable for size, weight It is a device package with high requirements in many aspects and performance, so it is very suitable for high-speed, high-performance modulus, radio frequency, microwave circuit and other packages in the military and high reliability fields. The chip of the existing ceramic leadless chip package structure is placed in the cavity of the ceramic part, and the interconnection between the chip and the bonding fingers of the shell is realized through the bonding wire or the silicon-aluminum wire, and the interconnection between the chip and the external ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/31H01L23/498
CPCH01L23/49548H01L23/49838H01L23/49816H01L23/3128H01L2224/16225
Inventor 杨振涛
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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