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Automatic wafer pod packaging device

A technology of packaging equipment and wafer cassettes, applied in the field of automation, can solve the problems of misplacement and misplacement, misplacement and leaking, low efficiency of manual operation, etc., and achieves the effect of improving the level of standardization and liberating manpower

Pending Publication Date: 2020-09-04
JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the above operations are mainly done manually, but the efficiency of manual operation is low, and it is prone to problems such as mis-posting, mis-posting, and mis-posting.

Method used

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  • Automatic wafer pod packaging device
  • Automatic wafer pod packaging device
  • Automatic wafer pod packaging device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] Please refer to Figure 1 to Figure 22 , a wafer cassette automatic packaging equipment 100, including a complete machine frame (not shown) and a feeding platform 2 installed on the complete machine frame, a first handling device 3, a packaging bag storage box 4, a bag-in Module 5, bag taking device 6, packaging platform 7, sealing module 8, third handling device 9, shaping rotary platform 10, shaping module 11, label printer 12, label reel 13, tearing label module 14, sticking A label robot 15, a tape roll release mechanism 16, a second transport device 17, and a discharge platform 18.

[0039] Please refer to figure 2 , the feeding platform 2 positions the wafer cassette 200 after the wafer cassette 200 is placed in an accurate position. The structure of the feeding platform 2 is: including a bottom plate 21 , a rail 22 , a first linear module 23 , a first placement platform 24 , a position detection sensor 25 , a product information identification sensor 26 and a ...

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PUM

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Abstract

An automatic wafer pod packaging device comprises a bagging module, a bag fetching device, a packaging platform and a sealing module. The bag fetching device grabs a packaging bag to the packaging platform. The bag fetching device cooperates with the packaging platform to open the packaging bag to form an opening, and the bagging module conveys the wafer pod into the packaging bag from the opening. The sealing module seals the opening. The automatic wafer pod packaging device achieves automation, frees labor, improves the standardization level of wafer pod packaging and meets the requirementsof the industry 4.0 of intelligent manufacturing and unmanned manufacturing.

Description

technical field [0001] The invention relates to the field of automation, in particular to automatic packaging equipment for wafer boxes. Background technique [0002] Front-opening shipping box / full transparent wafer box, which can protect, transport, and store wafers, prevent wafer collision and friction, provide safety protection during transportation, loading and storage, good air density, and prevent particulate matter produce. The specific structure of the wafer cassette generally includes a larger main body for accommodating wafers and a smaller head protrudingly connected to the main body. When wafers are transferred between different manufacturing plants, they need to be packed into wafer boxes and packaged with aluminum foil bags to ensure the cleanliness and humidity requirements during transportation; at the same time, labels need to be posted on the wafer boxes For marking, materials such as desiccant and humidity cards need to be fixed on the wafer box to ensu...

Claims

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Application Information

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IPC IPC(8): B65B57/00B65B43/18B65B43/30B65B31/00B65B35/16B65B35/20B65B31/06B65B51/14B65B11/04B65B61/28B65C9/02B65C9/06B65C9/26B65C9/46
CPCB65B11/045B65B31/00B65B31/06B65B35/16B65B35/20B65B43/18B65B43/30B65B51/146B65B57/00B65B61/28B65B2220/16B65C9/02B65C9/06B65C9/26B65C9/46
Inventor 周芸福许所昌王新征龚炳建黎微明胡彬
Owner JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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