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Long laminate, method for producing same, and printed wiring board

A manufacturing method and a laminated body technology, which are applied in the manufacture of printed circuit precursors, printed circuits, printed circuits, etc., can solve the problems of low dimensional stability of fluororesin films, and achieve thin film and signal transmission, dimensional stability and Excellent folding resistance

Active Publication Date: 2020-09-04
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, fluororesin films have lower dimensional stability at high temperatures than conventional heat-resistant resin films such as polyimide films.

Method used

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  • Long laminate, method for producing same, and printed wiring board
  • Long laminate, method for producing same, and printed wiring board
  • Long laminate, method for producing same, and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0302] Hereinafter, the present invention will be described in detail through examples, but the present invention is not limited thereto.

[0303] Examples 1-15, 19, and 20 are examples, and examples 16-18 are comparative examples.

[0304] (The ratio of each unit in the fluoropolymer)

[0305] The ratio of the NAH unit in the fluoropolymer is determined by the following infrared absorption spectrum analysis. The ratio of units other than NAH units was determined by melt NMR analysis and fluorine content analysis.

[0306] (Infrared absorption spectroscopic analysis)

[0307] The fluoropolymer was press-molded to obtain a film with a thickness of 200 μm. The film was analyzed by infrared spectroscopy to obtain an infrared absorption spectrum. In the infrared absorption spectrum, the absorption peak of the NAH unit in the fluoropolymer appears at 1778cm -1 . To measure the absorbance of the absorption peak, use the molar absorptivity of NAH 20810mol -1 ·L·cm -1 The rati...

manufacture example 1

[0362] The methyl ethyl ketone of the nonionic surfactant of the resin powder P-1 of 120g, 12g (Nios Co., Ltd. manufacture, Ftergent710FL), the methyl ethyl ketone of 234g is dropped in the horizontal ball mill, with the zirconium bead of diameter 15mm the resin powder P-1 was dispersed to obtain a liquid composition. Use a die coater to coat the liquid composition on the surface of the long strip of copper foil-1 in a roll-to-roll manner, dry it at 100°C for 15 minutes under a nitrogen atmosphere, and then dry it at 350°C under a nitrogen atmosphere. After firing for 5 minutes, annealing was performed to obtain a long copper foil-1 with a fluororesin layer. The results are shown in Table 2.

manufacture example 2

[0364] A long copper foil-2 with a fluororesin layer was obtained in the same manner as in Production Example 1 except that the thickness of the fluororesin layer was changed. The results are shown in Table 2.

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Abstract

Provided are: a long laminate which enables the achievement of a printed wiring board that is capable of achieving a good balance between reduction in the thickness of a resin layer and increase in the signal transmission speed, while having excellent dimensional stability and excellent folding endurance and being free from wrinkles in a fluororesin layer; a method for producing a long laminate which has a thin fluororesin layer that is free from wrinkles; and a printed wiring board. A long laminate 10 which comprises: a metal layer 12 that is formed of a long metal foil; a fluororesin layer 14 which is in contact with the metal layer 12 and contains a fluororesin; and a heat-resistant resin layer 16 which is in contact with the fluororesin layer 14 and contains a heat-resistant resin. This long laminate 10 is configured such that: the thickness of each layer of the fluororesin layer 14 is 1-10 [mu]m; the ratio of the total thickness T1 of the fluororesin layer 14 to the total thickness T2 of the heat-resistant resin layer 16, namely (T1 / T2) is from 0.3 to 3.0; and the sum of the total thickness of the fluororesin layer 14 and the total thickness of the heat-resistant resin layer 16 is 50 [mu]m or less.

Description

technical field [0001] This invention relates to the long laminated body which has the metal layer which consists of metal foil, and a resin layer, its manufacturing method, and a printed wiring board. Background technique [0002] A laminate (copper-clad laminate, etc.) having a metal layer made of metal foil and a resin layer can be used as a printed wiring board by processing the metal layer by etching or the like. Along with miniaturization of electronic equipment and increase in capacity of communication traffic, reduction in thickness of resin layers corresponding to miniaturization and increase in speed of signal transmission corresponding to increase in capacity are required for printed wiring boards. [0003] When the resin layer is formed into a thin film, the width of the conductor circuit becomes narrower due to impedance matching. Therefore, the resistance of the conductive circuit increases, making it difficult to increase the speed of signal transmission. In...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/082H05K1/03
CPCB32B15/082H05K2201/015H05K2203/1545H05K1/036H05K2201/0154H05K2201/0355H05K2201/0358H05K3/386H05K2201/0195H05K3/022B32B37/0046H05K1/03H05K1/092
Inventor 笠井涉细田朋也山边敦美
Owner ASAHI GLASS CO LTD