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Flexible circuit board test device and test method thereof

A technology of flexible circuit boards and testing equipment, which is applied in electronic circuit testing, printed circuit testing, continuity testing, etc., and can solve problems such as the inability to arrange microneedles

Pending Publication Date: 2020-09-08
淮安杰鼎唐科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this practice is to provide a flexible printed circuit board testing equipment and its testing method, so as to alleviate the existing technology of using micro-needle contact test points for testing, because the test points are too dense, it will lead to the technology that the micro-needles cannot be arranged question

Method used

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  • Flexible circuit board test device and test method thereof
  • Flexible circuit board test device and test method thereof
  • Flexible circuit board test device and test method thereof

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Embodiment Construction

[0057] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0058] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention provides a flexible circuit board test device and a test method thereof, and relates to the technical field of electrical performance test devices. The flexible circuit board test devicecomprises a test machine and a control device; the test machine comprises a test board, a main test mechanism, an auxiliary test mechanism and a visual system. The main test mechanism comprises an upper die assembly, a lower die assembly and an upper die driving module. The lower die assembly is provided with a mounting area; the upper die driving module is connected with the upper die assembly;the auxiliary testing mechanism comprises a testing flexible board and an auxiliary driving module; the auxiliary driving module is connected with the test flexible board; and the visual system comprises an acquisition part, and the acquisition part is used for acquiring image information of the mounting area and sending the image information to the control device, so that one group of test pointsof the test flexible board are superposed with the other group of test points of the to-be-tested flexible circuit board. The technical problem that in the prior art, microneedles cannot be arrangeddue to the fact that the microneedles make contact with test points for testing and the test points are too dense is solved.

Description

technical field [0001] The invention relates to the technical field of testing devices for electrical properties, in particular to a flexible circuit board testing device and a testing method thereof. Background technique [0002] FPC (Flexible Printed Circuit, flexible circuit board) needs to use electric test fixture to carry out power-on test before leaving the factory. The general technical method is to conduct continuity test by contacting the test point (such as gold finger) of the flexible circuit board with micro-needles. [0003] With the improvement of the integration of electronic circuits and the increase of users' requirements for product lightweight, the lines of flexible circuit boards are becoming more and more dense, and the golden finger features for connection are also becoming more and more dense. If you still use micro-needle contact test points for testing , because the test points are too dense, the microneedles cannot be arranged. Contents of the in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/04G01R31/54
CPCG01R1/04G01R31/2808G01R31/2812G01R31/54
Inventor 高征王启龙陈龙许兵兵
Owner 淮安杰鼎唐科技有限公司