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Calibration and monitoring method of wafer loading system and wafer loading system

A wafer and chip loading technology, applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of resource waste, economic loss, time failure, etc., to avoid waste of resources and avoid abnormal conditions.

Active Publication Date: 2021-09-28
SHANGHAI PRECISION MEASUREMENT SEMICON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the calibration is not timely, the equipment will not work properly or increase a lot of time. Frequent, it will take up too much normal working time of the equipment, resulting in a waste of resources

Method used

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  • Calibration and monitoring method of wafer loading system and wafer loading system
  • Calibration and monitoring method of wafer loading system and wafer loading system
  • Calibration and monitoring method of wafer loading system and wafer loading system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Figure 1B It is a flow chart of a wafer-on-chip system calibration method in an embodiment of the present invention, and the embodiment of the present invention is applicable to adopting Figure 1A The wafer loading operation is carried out by the semiconductor equipment. This method is implemented by running the wafer loading system components, combined with software and algorithms, and is specifically configured in the electronic equipment. The electronic equipment can be the data and logic in the wafer loading system. Processing equipment, such as computers.

[0043] like Figure 1B A method for calibrating a wafer-on-wafer system is shown, including:

[0044]S111. Obtain statistical data of wafer loading parameters for repeated wafer loading of the calibration wafer.

[0045] Wherein, the loading parameters of the standard wafer include wafer center parameters and wafer orientation parameters. The wafer center parameter is the coordinate position (X, Y) of the w...

Embodiment 2

[0060] After the above calibration of the wafer loading system is completed, it means that the system is in a normal state and can be used for manufacturing. figure 2 It is a flow chart of wafer loading system monitoring in an embodiment of the present invention, which is used for monitoring the real-time status of the wafer loading system during equipment production. The monitoring method of the wafer loading system first completes the calibration of the wafer loading system based on the above calibration method, further comprising:

[0061] S211. Obtain the current loading parameters of each wafer in the equipment operation; wherein, the current loading parameters include wafer center parameters and wafer orientation parameters.

[0062] When the semiconductor equipment is working, the equipment will first perform wafer alignment after each automatic loading, so a set of wafer center position (X, Y) and wafer orientation angle θ can be obtained, which is the current loading...

Embodiment 3

[0090] image 3 It is a monitoring flow chart of a wafer loading system in an embodiment of the present invention. The embodiments of the present application are optimized and improved on the basis of the technical solutions of the foregoing embodiments. Based on the recalibration judgment made in the above-mentioned monitoring of the wafer loading system and the results of the corresponding processing, the first parameter adjustment factor in the second working parameter of the wafer loading system is automatically adjusted, so as to be closer to the loading of each device. The actual working condition of the system improves the monitoring accuracy of the on-chip system.

[0091] like image 3 The shown monitoring method of the wafer loading system is implemented based on the monitoring method of the wafer loading system described in the second embodiment, and further includes:

[0092] S311, adjusting the upper boundary of the first boundary threshold range based on the t...

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Abstract

The application discloses a method for calibrating and monitoring a wafer loading system and a wafer loading system. The calibration method includes: obtaining the statistical data of the loading parameters of the repeated loading of the calibration wafer; verifying the statistical data by setting the calibration compliance conditions, and judging whether the wafer loading system is normal according to the verification results; acquiring and saving the wafer loading parameters. The first working parameter and the second working parameter of the chip system. The monitoring method includes: obtaining the current loading parameters of each wafer in equipment operation; obtaining the monitoring value of the current loading parameters according to the current loading parameters and the second working parameter; determining whether the wafer loading system needs Perform a recalibration. By optimizing the calibration method of the wafer-on-chip system, the first and second working parameters are obtained, so that the system can work normally depending on these working parameters. At the same time, based on these working parameters, the working status of the system is monitored, and it is judged in time whether the system is abnormal and needs to be recalibrated, which optimizes the timing of calibration.

Description

technical field [0001] Embodiments of the present invention relate to large-scale integrated circuit manufacturing and process testing equipment, in particular to a calibration and monitoring method for maintaining the working status of wafer-on-chip systems in these devices, and a wafer-on-chip system suitable for semiconductor equipment. Background technique [0002] Semiconductor large-scale integrated circuit production and testing equipment, referred to as semiconductor equipment, the normal work of its components depends on accurate working parameters, and these parameters are mainly obtained by the calibration of these components. [0003] Typically semiconductor device work involves two steps. First, the user formulates the work menu (recipe) offline in advance, and the work menu includes the steps of the main tasks of the equipment; second, during normal operation, the equipment automatically repeats the work menu at high speed and in-line for the same type of wafer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67259
Inventor 刘骊松
Owner SHANGHAI PRECISION MEASUREMENT SEMICON TECH INC