LED display device, preparation method thereof and display equipment

A display device, LED chip technology, applied in the direction of electric solid devices, semiconductor devices, instruments, etc., can solve the problems of poor bonding force between solder resist ink and packaging glue, easy separation, affecting the stability and reliability of LED display devices, etc. Achieve improved stability and reliability, improved air tightness, improved contrast and sharpness

Pending Publication Date: 2020-09-08
江西兆驰光元科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor binding force between the solder resist ink and the encapsulation glue, the two are easy to separate, and the external water vapor will penetrate into the LED chip through the gap formed by the separation of the solder resist ink and the encapsulation glue, thereby affecting the LED chip. Displays device stability and reliability

Method used

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  • LED display device, preparation method thereof and display equipment
  • LED display device, preparation method thereof and display equipment
  • LED display device, preparation method thereof and display equipment

Examples

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Embodiment Construction

[0030] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0031] Those skilled in the art can understand that, unless otherwise stated, the word "comprising" used in the description of the present invention refers to the presence of the features, integers, steps, operations, parts / components and / or components, but does not exclude the presence or Add one or more other features, integers, steps, operations, parts / parts, components and / or groups thereof. It should be understood that when we refer to a part / component as being "connected" to another part / component, it may be directly connected to t...

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Abstract

The invention provides an LED display device, a preparation method thereof and display equipment. The LED display device comprises a substrate, pixel points arranged on the base plate, and packaging glue being coated on the substrate and covering the pixel points. Each pixel point comprises at least one LED chip, the substrate comprises a base material and solder resist ink which surrounds the pixel points and is arranged on the base material, and a gap is formed between the solder resist ink and the edge of the base material. According to the LED display device, a gap is formed between the solder resist ink and the edge of the base material, that is, the packaging glue at the edge is fixed with the substrate through the base material, and no gap is generated at the edge of the LED displaydevice due to poor bonding force between the packaging glue and the solder resist ink, so that the air tightness is improved, and water vapor is effectively prevented from permeating into the LED display device.

Description

technical field [0001] The invention relates to the technical field of LED display, in particular to an LED display device, a preparation method thereof, and a display device using the LED display device. Background technique [0002] At present, due to the advantages of bright colors, wide dynamic range, high brightness, low power consumption, long life, impact resistance, stability and reliability, LED display screens have become the most advantageous new generation display media, and are widely used in large squares, Commercial advertisements, stadiums and other places. [0003] The LED display screen is mainly composed of a plurality of LED display devices assembled. The existing LED display devices are generally composed of a substrate, an LED chip and an encapsulation glue. The substrate includes solder resist ink arranged around the LED chip. The ink extends to the edge of the overall structure of the LED display device, and the packaging glue covers the solder resis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/60H01L33/58H01L33/56H01L33/48H01L25/075G09F9/33
CPCG09F9/33H01L25/0753H01L33/486H01L33/56H01L33/58H01L33/60H01L2933/0033H01L2933/005H01L2933/0058
Inventor 周波何至年唐其勇朱弼章
Owner 江西兆驰光元科技股份有限公司
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