Pushing apparatus for test handler

Abstract

The present invention relates to a pressing device for a test handler supporting a semiconductor device test. According to the present invention, the pressing device for a test handler has a pressingplate which has a match plate fixed to make a side end of the match plate have a first gap with a facing surface of a first guide rail and the other end to have a second gap with a facing surface of asecond guide rail. Also, the match plate is fixed to make a virtual reference line, which passes through the match plate while being parallel to the detachment movement direction of the match plate,be a reference related to the thermal expansion and thermal shrinkage of the match plate. The virtual reference line has the minimum distance to both side ends of the match plate being longer than theminimum distance to the center point of the main plate or passes through the center point. The pressing device can ensure a sophisticated electrical connection between semiconductor devices and a tester, thereby preventing damage to the test sockets, insert units, and semiconductor devices.

Description

[0001] This application is a divisional application of a patent application with an application date of December 19, 2017, an application number of 201711373476.X, and a patent application titled "Pressure Device for Test Sorter". technical field [0002] The present invention relates to a pressurizing device for a test handler, and more particularly to a pressurizing device for a test handler capable of responding to expansion or contraction due to heat. Background technique [0003] After the multiple semiconductor devices produced are tested by the tester, they are divided into good products and defective products, and only good products are shipped. [0004] The electrical connection between the tester and the semiconductor device is realized by a test sorter, and the present invention is a technology capable of coping with thermal expansion or contraction during high-temperature testing or low-temperature testing. The technology of the test sorter related to the present...

AI Technical Summary

Problems solved by technology

[0026] However, the existing technology is based on the structural design of two matching boards corresponding to one test tray, and it can be appropriately applied when the widths of the two matching boards are reduced based on the reference line. It is difficult to apply properly when the widths of the two matching plates are enlarged

The reason is that, when the respective widths of the two matching plates are made larger based on the reference line, the position of the pressing part whose distance from the reference line is large will of course change greatly, so the above-mentioned problem still exists.

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