Device capable of removing soldering tin of partial components on circuit board
A technology for circuit boards and components, applied in the field of solder removal devices, can solve the problems of time-consuming, labor-intensive, and easily damaged boards.
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[0015] Combine below Figure 1-Figure 5 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.
[0016]A device for removing solder on some components on a circuit board according to the present invention includes a housing 11, the housing 11 is provided with a working chamber 12 with an upward opening, and the lower wall of the working chamber 12 is moved with a The slider 44 is provided with a travel chamber 47 inside, the left and right walls of the travel chamber 47 are connected to slide and provided with a screw 30, and the side walls of the working chamber 12 are surrounded by a ring chamber 28 with an opening inward , the lower wall of the ring cavity 28 is provided with a ring rack 29, the right end of the screw 30 is fixedly connected with a steering wheel 73, and ...
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