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Hyperspectral line scanning 3D measuring device and measuring method

A measurement device and measurement method technology, applied in the field of 3D measurement, can solve problems such as low precision, inability to accurately measure transparent materials, and inability to measure large arc surfaces, so as to achieve the effect of high-precision 3D measurement

Pending Publication Date: 2020-09-15
中科蓝海(扬州)智能视觉科技有限公司
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AI Technical Summary

Problems solved by technology

Structured light 3D scanning technology developed earlier. Because it is surface measurement, the measurement efficiency is very high, but its fatal defect of low precision cannot be applied to high-precision measurement; laser projection triangulation measurement, because it needs to form a triangular area, Therefore, it is easy to form a shadow area during measurement, and the shadow area cannot be measured. This method cannot accurately measure transparent materials, and it cannot also measure large arc surfaces; the recently developed high-precision measurement method of spectral confocal measurement, this method It has high precision and overcomes the defects of laser projection triangulation, but because it is a point measurement, the efficiency of measurement is greatly reduced, and it is impossible to quickly complete a comprehensive scan of the product

Method used

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  • Hyperspectral line scanning 3D measuring device and measuring method
  • Hyperspectral line scanning 3D measuring device and measuring method
  • Hyperspectral line scanning 3D measuring device and measuring method

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Embodiment Construction

[0039] Embodiments of the present invention will now be described with reference to the accompanying drawings.

[0040] figure 1 It is a structural schematic diagram of the hyperspectral 3D measuring device of the present invention.

[0041] For the hyperspectral line scanning 3D measuring device and measurement of the present invention include a light source 20, an optical head 30, a photometer 40, a processor 50, the optical head 30 is below the photometer 40, and the light source 20 is placed under the optical head 30- side;

[0042] The light source 20 emits polychromatic strip light of various wavelengths, and the shape of the light is linear. The light source 20 adopts a white LED as the light source, and emits linear scattered light; the blue wavelength range to the red wavelength range, white light W of several visible beams of different wavelengths, the wavelength is about 450nm-660nm, the light source 30 is located on the side, and the light Horizontally illuminat...

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Abstract

The main purpose of the invention is to provide a 3D measuring device based on hyperspectrum, a linear light source is adopted to realize the linear scanning measurement of an object, and the scanningspeed is accelerated. In order to achieve the purpose, the invention provides a hyperspectral line scanning 3D measuring device and a measuring method, the hyperspectral line scanning 3D measuring device comprises a light source 20, an optical head 30, a photometer 40 and a processor 50, the optical head 30 is arranged below the photometer 40, and the light source 20 is arranged at one side of the optical head 30; the optical head 30 comprises an objective lens 31 and a beam splitter 32, the photometer 40 comprises a light filter plate 41, a collimating lens 42, a grating 43, an imaging lens44 and an area array sensor 45, and the processor 50 is connected with the area array sensor 45 of the photometer 40 through a signal cable 46.

Description

technical field [0001] The invention relates to the technical field of 3D measurement, in particular to a hyperspectral-based 3D measurement method and device. [0002] technical background [0003] Among the existing 3D measurement technologies, there are mainly structured light 3D scanning, laser projection triangulation measurement, and spectral confocal measurement. Structured light 3D scanning technology developed earlier. Because it is surface measurement, the measurement efficiency is very high, but its fatal defect of low precision cannot be applied to high-precision measurement; laser projection triangulation measurement, because it needs to form a triangular area, Therefore, it is easy to form a shadow area during measurement, and the shadow area cannot be measured. This method cannot accurately measure transparent materials, and it cannot also measure large arc surfaces; the recently developed high-precision measurement method of spectral confocal measurement, this...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/25
CPCG01B11/2513G01B11/2504
Inventor 谭良李清顺
Owner 中科蓝海(扬州)智能视觉科技有限公司
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