Chip-on-film (COF) package structure

Abstract

The invention provides a COF packaging structure including a flexible substrate, a circuit layer, a chip, an encapsulant and a heat sink. The circuit layer and the chip are located on the flexible substrate. The chip is electrically connected to the circuit layer. The circuit layer is located between the flexible substrate and the chip. The chip has a first side surface and a second side surface opposite to each other. The encapsulant fills at least a gap between the flexible substrate and the chip. The encapsulant includes a first part covering the first side surface of the chip and a secondpart covering the second side surface of the chip. The heat sink is located on the flexible substrate and covers the chip and the encapsulant. The heat sink has at least two openings, and the two openings are respectively located on opposite sides of the chip. One of the two openings partially exposes the first part of the encapsulant, and the other of the two openings partially exposes the secondpart of the encapsulant.

Description

technical field [0001] The invention relates to a package structure, in particular to a film-on-chip package structure. Background technique [0002] In order to improve the heat dissipation effect of the current Chip on Film package (COF), heat dissipation patches are attached on the surface of the package structure, especially on the surface with the chip. Generally speaking, the heat dissipation patch is attached to the chip packaging structure by rolling. Since the chip has a certain height and the underfill material (i.e., the encapsulant) covering the chip is in an irregular slope shape, the rolling When attaching the heat dissipation patch on the chip in this way, there may be arches and gaps due to the heat dissipation patch not conforming to the tight fit of the chip and the encapsulant. In addition, since the heat dissipation patch will completely cover the chip and the encapsulation compound, it is impossible to effectively confirm whether the heat dissipation pa...

AI Technical Summary

Problems solved by technology

Generally speaking, the heat dissipation patch is attached to the chip packaging structure by rolling. Since the chip has a certain height and the underfill material (i.e., the encapsulant) covering the chip is in an irregular slope shape, the rolling When attaching the heat dissipation patch on the chip, there may be arches and gaps due to the heat dissipation patch not conforming to the tight fit between the chip and the encapsulant

In addition, since the heat dissipation patch will completely cover the chip and the encapsulation compound, it is impossible to effectively confirm whether the heat dissipation patch, the chip and the encapsulation compound are tightly bonded after attachment, and it may be caused by the arching of the heat dissipation patch and the formation of gaps. Problems leading to poor cooling efficiency

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