Semiconductor process equipment and sealing door mechanism thereof
A process equipment, sealing door technology, applied in semiconductor/solid-state device manufacturing, conveyor objects, electrical components, etc., can solve the problems of high failure rate, sealing failure, short life of sealing door mechanism, etc., to reduce the failure rate, prolong the The effect of long service life and simple structure
Active Publication Date: 2020-09-18
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0003] In view of the shortcomings of the existing methods, this application proposes a hermetic door mechanism and semiconductor process equipment to solve the technical problems of sealing failure, short service life of the hermetic door mechanism or high failure rate in the prior art
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[0028] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.
[0029] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...
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The embodiment of the invention provides semiconductor process equipment and a sealing door mechanism thereof. The sealing door mechanism is used for sealing and isolating a basket loading and unloading area and a manipulator working area of semiconductor process equipment, and comprises a guide rail assembly, a driving assembly and a sealing assembly; the guide rail assembly comprises a frame, and path guide rails are arranged on the two sides of the frame; the sealing assembly comprises a sealing door and path rollers; the sealing door is used for sealing a communication channel for communicating the basket loading and unloading area with the manipulator working area; path rollers are arranged on the two sides of the sealing door and are in sliding fit with the path guide rails; the driving assembly is connected with the sealing door and used for driving the sealing door to slide along the path guide rail relative to the frame, and when the path roller slides to the end of the path guide rail, the sealing door seals the communication channel under the guide effect of the path guide rail. According to the embodiment, the sealing effect can be effectively improved, and the servicelife is prolonged.
Description
technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor process equipment and a hermetic door mechanism thereof. Background technique [0002] At present, the loading and unloading device of silicon carbide (SiC) high temperature furnace is divided into loading and unloading area of flower basket (Cassette) and working area of robot (Robot). Because the working area of manipulator is connected with the process chamber, it needs to be always isolated from the outside world to ensure cleanliness Spend. During the normal loading and unloading process, the two areas are connected. When the flower basket is filled and taken away, the loading and unloading area of the flower basket needs to be connected to the external environment. At this time, in order to ensure that the working area of the manipulator is always kept isolated from the external envir...
Claims
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IPC IPC(8): H01L21/677
CPCH01L21/67706Y02P70/50
Inventor 陈志兵王昭辉李旭刚
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD