A kind of epoxy resin for low temperature curing powder coating and its preparation method and low temperature curing powder coating
A technology of epoxy resin and powder coating, applied in the direction of epoxy resin coating, powder coating, coating, etc., can solve the problems of reducing the physical and chemical properties and decorative effect of the coating, reducing the activation energy of the system reaction, high melt viscosity, etc., and achieve low temperature The effect of good mechanical properties, good mechanical properties and high gloss
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[0031] The present invention provides the preparation method of epoxy resin described in above-mentioned technical scheme, comprises the following steps:
[0032] (1) Mix benzene ring-containing raw material, epichlorohydrin, phase transfer catalyst and solvent, carry out ring-opening reaction, obtain phthalic acid dichlorohydrin, and described phthalic acid dichlorohydrin has the structure shown in formula III ;
[0033]
[0034] (2) Bisphenol A, epichlorohydrin, lye and the dichlorohydrin phthalate are mixed to carry out a polymerization reaction to obtain an epoxy resin for low-temperature curing powder coating;
[0035] The benzene ring-containing raw material is a benzene ring-containing organic acid and / or a benzene ring-containing anhydride;
[0036] The benzene ring-containing organic acid includes one or more of phthalic acid, terephthalic acid and isophthalic acid; the benzene ring-containing anhydride is phthalic anhydride.
[0037] The invention mixes the raw ...
Embodiment 1
[0053] Add 2 mol of terephthalic acid and 12 mol of dimethyl sulfoxide into a three-necked flask, heat and stir at 80 rpm and 70°C to dissolve, and after complete dissolution, add 4.2 mol of epichlorohydrin and heat up to 90°C. Continue to stir at 100rpm, carry out the ring-opening reaction for 2h, and then vacuumize the obtained system at 130°C and -0.1MPa to obtain dichlorohydrin phthalate, which is dissolved in In toluene, obtain phthalic acid dichlorohydrin solution;
[0054] Dissolve 2 mol of bisphenol A in 960 g of sodium hydroxide solution (mass concentration is 10%), heat up to 55°C, stir at 250rpm until completely dissolved, then cool down to 40°C, add 2.2mol of epichlorohydrin, 1.1 mol phthalic acid dichlorohydrin solution, continue to linearly increase the temperature to 98°C, and carry out the polymerization reaction for 2.5 hours. After the reaction, the obtained system is washed with boiling water for 3 times, and vacuum-dried at 130°C and -0.1MPa for 0.5h. An e...
Embodiment 2
[0060] Add 2 mol of phthalic acid and 12 mol of dimethyl sulfoxide into a three-necked flask, heat and stir at 80 rpm and 75°C to dissolve, and after complete dissolution, add 4.2 mol of epichlorohydrin and heat up to 90°C. Continue to stir at 100rpm, carry out the ring-opening reaction for 2h, and then vacuumize the obtained system at 130°C and -0.1MPa to obtain dichlorohydrin phthalate, which is dissolved in In toluene, obtain phthalic acid dichlorohydrin solution;
[0061] Dissolve 2 mol of bisphenol A in 1000 g of sodium hydroxide solution (mass concentration is 11%), heat up to 55°C, stir at 250rpm until completely dissolved, then cool down to 40°C, add 1.3mol of epichlorohydrin, 2mol The dichlorohydrin phthalic acid solution was heated linearly to 95°C, and the polymerization reaction was carried out for 2.5h. After the reaction, the obtained system was washed with boiling water for 3 times, and vacuum-dried at 130°C and -0.1MPa for 0.5h to obtain Epoxy resins for low t...
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