Multi-wire cutting device

Abstract

The invention discloses a multi-wire cutting device. The multi-wire cutting device comprises a machining table, a cutting wire, a driving wire groove shaft, a driven wire groove shaft and an adjustingmechanism, the machining table is arranged above the cutting wire, when the machining table moves in the vertical direction, wire cutting is carried out on a workpiece loaded on the machining table through the cutting wire; the cutting line is wound between the driving line groove shaft and the driven line groove shaft to form an upper cutting line net and a lower cutting line net; the adjustingmechanism comprises a control unit and two telescopic units connected to the control unit; the two telescopic units are arranged below the upper cutting wire net separately and are close to one side of the driving wire groove shaft or one side of the driven wire groove shaft respectively; and the control unit is used for controlling the telescopic units on one side of the driving wire groove shaftor one side of the driven wire groove shaft to jack up the upper cutting wire net by a set height when wire cutting is carried out on the workpiece. According to the multi-wire cutting device, the upper cutting wire net can be supported through the telescopic adjusting mechanism, the amplitude of the cutting wire is controlled, and the quality of a silicon wafer obtained through cutting is improved.

Description

technical field [0001] The present invention relates to the technical field of wire cutting, and more particularly, relates to a multi-wire cutting device. Background technique [0002] Ingot processing mainly adopts two methods: multi-wire cutting and inner circle cutting. Compared with the inner circle cutting method, the multi-wire cutting method has higher cutting effect and higher yield, and is more widely used. The multi-wire cutting mechanism of the ingot is: fix the ingot to be cut on the processing table that can move up and down, when the processing table gradually descends, the ingot fixed on the processing table is separated by the cutting line moving at high speed below, so as to Cut the ingot into several silicon wafers of required size. [0003] During the multi-wire cutting process, the processing table is slowly lowered, and the silicon rod is cut in contact with the cutting wire, which reciprocates at a high speed. Due to the mechanical movement, the cut...

AI Technical Summary

Problems solved by technology

Since the length of the cutting line between the silicon rod and the axis of the slot changes continuously during the entire cutting process of the silicon rod, the cutting line has different amplitudes of vibration during the whole process, which affects the quality of the cut silicon wafer

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