Thickness measuring equipment, polishing system and polishing material management method

Abstract

The invention provides a thickness measuring device, a polishing system and a polishing material management method. The thickness measuring equipment includes a bearing platform and a measuring device; the bearing platform is used to carry the material basket, and there are multiple charging ports on the material basket, and linings are arranged on the inner sides of the charging ports one by one; the measuring device is located on the carrier platform On one side, the measurement device includes a drive module and a measurement module connected to the drive module; the measurement module includes a light source transmitter, a beam splitter, a light receiver and a processing unit, the light source transmitter is used to emit multi-color light sources, and the beam splitter is used for After splitting the multi-color light source into the lining, the light receiver is used to receive the light source reflected by the lining, and the processing module is connected with the light receiver to obtain the thickness of the lining based on the light source information received by the light receiver. The invention can timely discover the problem of inconsistent lining thickness, avoid inconsistent polishing thickness caused by inconsistent lining thickness, effectively reduce the risk of misjudgment, and reduce the waste of raw materials.

Description

technical field [0001] The invention relates to the technical field of crystal growth, in particular to a thickness measuring device, a polishing system and a polishing material management method. Background technique [0002] With the increasing integration of integrated circuit devices and the shrinking of device feature sizes, the flatness of the wafer surface has an increasing impact on the process yield. High requirements also have to increase investment, and more and more attention is paid to polishing equipment and processes. [0003] Such as figure 1 As shown, in the common polishing equipment, the wafer 23 is clamped between the polishing components 24 through the fixing of the material basket 21 (Carrier) and the inner liner 22 (Insert) to perform single-side or double-side polishing. Specifically, there are multiple material baskets on a single polishing device, and there are multiple circular charging ports (slots) on a single material basket, and the lining is...

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a thickness measurement device, a polishing system and a polishing material management method, which are used to solve the problems in the prior art by measuring the consistency of the thickness of the polished wafer. Judging whether the lining thickness on the same polishing equipment is the same, there is a great risk of misjudgment, and when multiple lining thicknesses on the same polishing equipment are detected to be inconsistent, all baskets on the equipment will be scrapped, resulting in raw material waste and rising production costs

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