Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Packaging structure for producing light emitting diode base

A technology of packaging structure and diode holder, which is applied in the directions of electrical components, electric solid devices, circuits, etc., can solve the problems of labor-intensive, cumbersome connection process between the light-emitting diode holder body and external devices, etc. Easy to connect effect

Inactive Publication Date: 2020-10-13
MAANSHAN ZHONGJIE ELECTRONICS TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a packaging structure for producing light-emitting diode sockets. By setting the shell and the connecting seat, the packaging process of the existing light-emitting diode socket body and the connection process between the light-emitting diode socket body and the external device are relatively cumbersome and costly. manpower

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging structure for producing light emitting diode base
  • Packaging structure for producing light emitting diode base
  • Packaging structure for producing light emitting diode base

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0022] see Figure 1-3 As shown, the present invention is a packaging structure for producing light-emitting diode sockets, including a housing 1 and a connecting seat 2, the housing 1 includes a housing 101 and an end cap 102, and the end cap 102 is screwed to the housing 101, and the housing 101 is lowered The side is fixedly connected with a connection seat 2, and the interior of the connection seat 2 is provided with a cavity 16, and the cavity 16 provided insi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a packaging structure for producing a light emitting diode base and relates to the technical field of electronic components. The packaging structure comprises a shell and a connecting seat; the shell comprises a shell body and an end cover; the end cover is in threaded connection with the shell; the lower side of the shell is fixedly connected with a connecting seat; one end of a cathode bar is fixedly connected with a reflecting plate; the upper side of the reflecting plate is fixedly connected with a blue LED chip, a green LED chip and a red LED chip through elargol;a cavity is formed in the connecting seat; a blue anode bar, a cathode bar, a green anode bar and a red anode bar are connected into the cavity formed in the connecting seat in a penetrating mode; connecting pieces are in contact connection with the upper sides of one ends of the blue anode bar, the cathode bar, the green anode bar and the red anode bar respectively; rubber head screws are in threaded connection with the front surface of the connecting seat; and one end of each rubber head screw abuts against the corresponding connecting piece. Through the shell and the connecting seat structure, the body of the light emitting diode base is convenient to package and connect with an external device.

Description

technical field [0001] The invention belongs to the technical field of electronic components, in particular to a package structure for producing light-emitting diode seats. Background technique [0002] Light-emitting diode, referred to as LED for short, refers to a semiconductor diode made of compounds containing gallium, arsenic, phosphorus, nitrogen, etc. that can convert electrical energy into light energy. Light-emitting diode packaging refers to the packaging of light-emitting chips. Compared with integrated Circuit packaging is quite different. LED packaging has special requirements for packaging materials, because LED packaging is not only required to protect the wick, but also to be able to transmit light. At present, the packaging structure of the production of LED holders has packaging processes and LED holders. The process of connecting the main body and external devices is cumbersome, labor-intensive and has relatively large limitations. Therefore, it is necessa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/075H01L33/52H01L33/60H01L33/62H01L33/50H01L33/64
CPCH01L25/0753H01L33/50H01L33/52H01L33/60H01L33/62H01L33/64
Inventor 朱俊温从众晋传彬
Owner MAANSHAN ZHONGJIE ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com