Test module of three-dimensional packaged chip

Abstract

The invention discloses a test module of a three-dimensional packaged chip, and relates to the technical field of printed circuit boards and three-dimensional packaged chips. The test module comprisesa plurality of laminated plates which are sequentially stacked from top to bottom, and a signal adapter plate arranged between every two adjacent laminated plates; at least one test spot welding discis arranged on each of the front and back surfaces of the laminated plates; the test spot welding discs on the front and back surfaces of the laminated plates are in one-to-one correspondence short circuit; the front surface and the back surface of the signal adapter plate are provided with signal switching pads, the signal switching pads on the front surface and the back surface of the signal adapter plate are arranged in a one-to-one correspondence manner, and the signal switching pads on the front surface and the back surface correspondingly arranged on the signal adapter plate are connected or disconnected, wherein the signal switching pads are electrically connected with the opposite test spot welding pads of the laminated plates in a one-to-one correspondence manner. According to the test module, the test steps are greatly simplified, the development cost is saved, the percent of pass of the laminated plate is increased, and the test reliability of the laminated plate is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards and three-dimensional packaging chips, in particular to a test module for three-dimensional packaging chips. Background technique [0002] Three-dimensional packaging is a packaging technology that realizes stacking multiple chips (packaged chips or bare chips) in a single package in a three-dimensional space. The vertical interconnection types of three-dimensional packaging module laminated boards (hereinafter referred to as laminated boards) are divided into multi-layer direct vertical interconnection of single-type devices, multi-layer vertical interconnection of single-type devices through PCB printed boards, and mixed-type devices through PCB printed boards. Multi-layer vertical interconnection, etc. [0003] Before each laminated board is stacked, it is often necessary to test and screen the electrical performance of each laminated board, so as to ensure that the connectivity...

AI Technical Summary

Problems solved by technology

When encountering complex system-level three-dimensional packaging modules, the test and verification of the entire verification board will become more complicated

When using this test method, when the number of laminated boards in a three-dimensional package structure is relatively large, the design size of the test board will be too large

[0005] The single-board independent test is to draw a special test board to test each laminated board separately. The independent test is prone to system risk and often leads to incomplete testing.

[0006] In the above two test methods, it is also necessary to fix each board with a specific fixture, and then lead the tested signal line to the test equipment through the test interface to complete the corresponding test; the specific fixture will also make the test process become more complicated

Images