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Material recycling die cutting process for whole-cut opening adhesive

A technology of cutting and glue, which is applied in the field of die-cutting technology, can solve the problems of great waste, discarding, and low utilization rate of glue materials.

Inactive Publication Date: 2020-10-27
SUZHOU W B ROYMAX ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The main material of mouth glue is generally more expensive colloidal material, accounting for more than 80% of the total material cost; the general process has two processes: full cutting and asynchronous sleeve cutting; if it is a full cutting process, it is often after punching The materials around it are used as useful finished products, while the materials in the middle are often discarded. This wastes a lot and causes the utilization rate of the glue material to be too low. In order to save valuable main materials, we propose a whole cut Sub glue material reuse die cutting process

Method used

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  • Material recycling die cutting process for whole-cut opening adhesive
  • Material recycling die cutting process for whole-cut opening adhesive
  • Material recycling die cutting process for whole-cut opening adhesive

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Embodiment Construction

[0021] In order to make the above objectives, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, many specific details are explained in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counter...

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Abstract

The invention relates to the field of die cutting processes, and particularly discloses a material recycling die cutting process for a whole-cut opening adhesive. The material recycling die cutting process comprises the process steps of raw material preparation, punching machine adjustment, punching, material taking and waste material rewinding. The material recycling die cutting process specifically comprises the following steps that S1, raw material preparation is conducted, specifically, an opening adhesive material needing to be cut is placed at the punching position of punching equipmentaccording to requirements; S2, punching machine adjustment is conducted, specifically, the angle of a die cutting die is adjusted according to the punching size and angle of the opening adhesive material; S3, punching is conducted, specifically, a punching machine is started, and an upper die of the punching machine is controlled to conduct downward cutting to punch the opening adhesive material;S4, material taking is conducted, specifically, a finished product and waste materials obtained after punching are taken out; and S5, waste material rewinding is conducted, specifically, a rewinding device is used for conducting rewinding collection on the waste materials obtained after punching is completed so that small-size punching can be conducted next time, and the utilization rate of the opening adhesive material is maximized. According to the die cutting process, the technological process is simple, the operation procedure is clear, the die cutting quality can be guaranteed, the utilization rate of the opening adhesive material can be maximized, and material saving is facilitated.

Description

Technical field [0001] The invention relates to the field of die-cutting technology, in particular to a die-cutting technology for material reuse of a whole-cut sub-glue. Background technique [0002] The main material of mouth glue is generally more expensive colloidal material, which accounts for more than 80% of the total material cost; the general process has two processes of cutting and asynchronous cutting; if it is a cutting process, it is often after punching The surrounding materials are used as useful finished products, and the materials in the middle are often discarded. This wastes a lot, causing the utilization rate of the mouth glue material to be too low. In order to save the precious main material, we propose a whole cut The sub-glue material is reused in a die-cutting process. Summary of the invention [0003] The main purpose of the present invention is to provide a die-cutting process for the material reuse of the whole cut sub-glue, which includes the process ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/38B26D7/18B26D7/26
CPCB26D7/18B26D7/2628B26F1/38
Inventor 周维江
Owner SUZHOU W B ROYMAX ELECTRONICS TECH