Guide apparatus for substrate transfer

Abstract

The invention provides a guide apparatus for substrate transfer which can prevent the substrate from swinging or bending in the transfer and processing process of the substrate so as to prevent the substrate from being damaged by impact and stably convey the substrate. To this end, the present invention discloses the following features: a side support roller for guiding the conveyance of a substrate while rotating in contact with the side surface of the substrate; a lower support roller that is disposed at a distance from the side support roller in the width direction of the substrate and supports the substrate while rotating in contact with the lower surface of the substrate; a base member that rotatably supports the side surface support roller and is provided so as to be capable of adjusting a gap between the side surface of the substrate and the side surface support roller; and a lower support member that rotatably supports the lower support roller, connects the base member and thelower support roller, and is provided so as to be capable of adjusting the position of the lower support roller.

Description

technical field [0001] The present invention relates to a substrate conveying and guiding device, and more specifically, to a substrate conveying and guiding device capable of preventing warping or damage of a side surface of a substrate during substrate conveying and processing. Background technique [0002] In general, substrates used in displays, semiconductor wafers, LCDs, and glass for photomasks are subjected to various processing steps. For example, the processing steps may include unit steps such as etching, stripping, rinsing, drying, and the like. [0003] In the process, the processing efficiency is improved by continuously performing the processing process on the substrate while transferring the substrate. [0004] Therefore, in order to improve the yield of substrates to be processed, a technique for stably maintaining the posture of the substrate being conveyed is required. [0005] refer to figure 1 A conventional substrate transfer device includes a substr...

AI Technical Summary

Problems solved by technology

[0007] However, the substrate G conveyed along such a substrate conveying device sometimes undergoes swinging or bending phenomena due to changes in load or pressure applied to the surface of the substrate G during the process.

[0008] Due to such swinging or bending phenomena of the substrate G, when the both side surfaces of the substrate G collide with the side support rollers 20 and impact, the substrate G may be defective or damaged.

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