Vapor chamber and processing method of vapor chamber

Abstract

The invention provides a vapor chamber and a processing method of the vapor chamber. The vapor chamber comprises a hot end close to a heat source and a cold end which is opposite to the hot end and far away from the heat source. The vapor chamber comprises a first cover plate and a second cover plate which is arranged opposite to the first cover plate and covers the first cover plate, wherein theside, which is close to the second cover plate, of the first cover plate is sunken away from the second cover plate to form a first groove, and the first cover plate and the second cover plate definea closed inner cavity filled with working liquid; the first cover plate comprises a bottom wall and a side wall, the bottom wall is opposite to the second cover plate and arranged at an interval, theside wall bends and extends towards the second cover plate from the periphery of the bottom wall and abuts against the second cover plate. The vapor chamber further comprises a capillary structure arranged on the bottom wall, wherein the thickness of the capillary structure is gradually increased in the direction from the hot end to the cold end. In the direction from the hot end to the cold end,the thickness of the capillary structure is gradually increased, the working liquid can flow to the hot end from the cold end more easily, the circulation speed of the working liquid from the liquid state to the gaseous state and then to the liquid state is higher, and the heat dissipation performance is better.

Description

【Technical field】 [0001] The invention relates to the technical field of heat conduction, in particular to a uniform temperature plate and a processing method for the uniform temperature plate. 【Background technique】 [0002] Electronic devices in related technologies usually use copper foil or graphite for heat dissipation. However, as some electronic devices become more powerful, they require higher heat dissipation performance, and copper foil or graphite heat dissipation methods gradually cannot meet the heat dissipation requirements. [0003] In order to solve the above problems, some vapor chambers are used in the related art to dissipate heat. However, due to certain structural shortcomings of the vapor chambers in the related art, the heat dissipation effect cannot meet expectations. [0004] Therefore, it is necessary to provide a novel vapor chamber to solve the above problems. 【Content of invention】 [0005] The object of the present invention is to provide a v...

AI Technical Summary

Problems solved by technology

[0002] Electronic devices in related technologies usually use copper foil or graphite for heat dissipation, but as some electronic devices become more powerful, they require higher heat dissipation performance, and copper foil or graphite heat dissipation methods gradually cannot meet the heat dissipation requirements.

[0003] In order to solve the above problems, some vapor chambers are used in the related art to dissipate heat. However, due to the structural shortcomings of the vapor chambers in the related art, the heat dissipation effect cannot meet expectations.

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