A Surface Optimization Method for Heterogeneously Integrated Piezoelectric Single Crystal Thin Film Substrates
A piezoelectric single crystal, integrated piezoelectric technology, applied in piezoelectric/electrostrictive/magnetostrictive devices, circuits, electrical components, etc., can solve the problems affecting the thickness uniformity of single crystal films, and improve the surface smoothness. degree, to ensure the effect of uniformity
Active Publication Date: 2021-12-24
SHANGHAI NOVEL SI INTEGRATION TECH CO LTD
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Problems solved by technology
[0005] The technical problem to be solved by the present invention is that the existing polishing method for the heterogeneously integrated piezoelectric single crystal thin film substrate will affect the thickness uniformity of the single crystal thin film
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[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0031] Reference herein to "one embodiment" or "an embodiment" refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present application. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom" etc. is based on the orientation or positional relationship shown in the drawings, and is only for It ...
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Abstract
The present invention relates to the technical field of material preparation, in particular to a method for optimizing the surface of a heterogeneously integrated piezoelectric single crystal thin film substrate, comprising: obtaining a heterogeneously integrated piezoelectric single crystal thin film substrate to be optimized, the piezoelectric single crystal The thin film substrate includes a support layer and a piezoelectric single crystal thin film layer; performing corrosion treatment on the piezoelectric single crystal thin film substrate to obtain a first product, and an corrosion layer is formed on the surface of the piezoelectric single crystal thin film layer of the first product; Polishing is performed on the first product to obtain a second product. A uniform corrosion layer with a certain thickness will be formed on the surface of the corrosion-treated piezoelectric single crystal film, and then the corrosion layer can be removed by chemical mechanical polishing with low back pressure, so as to realize the optimization of the surface of the piezoelectric single crystal film. The surface optimization method described in the embodiment of the present application can improve the surface flatness of the heterogeneously integrated piezoelectric single crystal thin film substrate and the lattice quality of the near-surface region of the film, and at the same time ensure the uniformity of the thickness of the piezoelectric single crystal thin film .
Description
technical field [0001] The invention relates to the technical field of material preparation, in particular to a method for optimizing the surface of a heterogeneous integrated piezoelectric single crystal thin film substrate. Background technique [0002] Lithium tantalate (LiTaO3) has excellent piezoelectric and pyroelectric properties, and is widely used in the manufacture of radio frequency front-end filters and pyroelectric detectors. Lithium tantalate belongs to the trigonal crystal system, 3m point group, and R3c space group. Due to the anisotropy of the lattice structure, it also reflects different cut types in application, and has different application fields. For example, in the field of radio frequency front-end devices, There are mainly 38-degree Y-X, 42-degree Y-X, 50-degree Y-X and other cut lithium tantalate single crystal wafers, and the pyroelectric field is mainly Z-cut lithium tantalate. With the popularization of fifth-generation mobile communications and...
Claims
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IPC IPC(8): H01L41/332H01L41/337H10N30/082H10N30/086
CPCH10N30/082H10N30/086
Inventor 欧欣鄢有泉
Owner SHANGHAI NOVEL SI INTEGRATION TECH CO LTD