Printed circuit board assembly and electronic device

A technology of printed circuit boards and circuit boards, which is applied in the directions of printed circuit components, printed circuits, electrical connection printed components, etc., can solve problems affecting user experience, increase production costs, and reduce product market competitiveness, so as to save production costs , reduce the number of layers, reduce the effect of the number of layers

Inactive Publication Date: 2020-10-30
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, when the devices on the PCB are very dense, in order to complete the electrical connection of each device as required, it is necessary to use a higher number of layers, which will greatly increase the production cost of the PCB, and d

Method used

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  • Printed circuit board assembly and electronic device
  • Printed circuit board assembly and electronic device
  • Printed circuit board assembly and electronic device

Examples

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Embodiment Construction

[0017] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0018] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the description in the accompanying drawings directions for the example described above. It will be appreciated that if the illustrated device is turned over so...

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PUM

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Abstract

The invention relates to a printed circuit board assembly and an electronic device, the printed circuit board assembly comprises a circuit board and a shielding cover, the shielding cover is arrangedat one side of the circuit board, and the shielding cover and the circuit board enclose an accommodating cavity, wherein the shielding cover comprises a shielding layer, a first insulating layer arranged on one side of the shielding layer, and at least one group of conductive layer and second insulating layer arranged on one side, deviating from the shielding layer, of the first insulating layer;and the second insulating layer is arranged on the side, away from the first insulating layer, of the conductive layer, and the conductive layer is electrically connected with the circuit board. According to the printed circuit board assembly provided by the invention, the number of layers of the printed circuit board can be reduced, the thickness of the printed circuit board is reduced, and the manufacturing cost of the printed circuit board is saved.

Description

technical field [0001] The present disclosure relates to the technical field of electronic equipment, in particular, to a printed circuit board assembly and electronic equipment. Background technique [0002] PCB (Printed Circuit Board, printed circuit board) is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. With the continuous improvement of mobile phone integration, designers are pursuing larger battery space and smaller motherboard area while reducing the size of mobile phones. Among them, controlling the occupied thickness of PCB has become the key to the design of electronic devices such as mobile phones. one of the factors. [0003] In the prior art, when the devices on the PCB are very dense, in order to complete the electrical connection of each device as required, it is necessary to use a higher number of layers, which will greatly increase the production cost of the PCB, an...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0216H05K1/0218H05K1/116
Inventor 江超
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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