Substrate machining device for semiconductor chilling plate production

Abstract

The invention relates to the technical field of semiconductor chilling plate machining accessory devices, in particular to a substrate machining device for semiconductor chilling plate production. Thedevice can be used for simultaneously polishing two surfaces of a ceramic chip so that the ceramic chip machining efficiency can be improved, and meanwhile, the difficulty of enabling the two polishing surfaces of the ceramic chip to have high parallelism is reduced. The device comprises a workbench and a polishing mechanism, and four supporting legs are arranged at the bottom end of the workbench; the device further comprises a fixing frame, a supporting plate, two adjusting plates, two extruding plates, two air cylinder assemblies, two supporting plates, two limiting shafts, two baffle rings, a lifting handle and a fixing plate, wherein the lower left area of the fixing frame is connected with the left side of the top end of the workbench, the top end of the fixing plate is connected with the bottom end of the upper right area of the fixing frame; and the polishing mechanism is provided with two motor assemblies, polishing wheels are arranged at the output ends of the two motor assemblies, the two motor assemblies are arranged in the upper left area of the fixing frame and the left end of the fixing plate, and a clamping groove is formed in the top end of the supporting plate.

Description

technical field [0001] The invention relates to the technical field of auxiliary devices for processing semiconductor refrigerating chips, in particular to a substrate processing device for producing semiconductor refrigerating chips. Background technique [0002] As we all know, ceramic chips are an important part of semiconductor refrigeration chips. When processing ceramic chips, it is necessary to polish the ceramic chips to improve the quality of semiconductor cooling chips. The substrate processing device for semiconductor cooling chips is a kind of During the production and processing of refrigerating sheets, the device used to polish ceramic sheets has been widely used in the field of semiconductor refrigerating sheet production; the existing substrate processing device for refrigerating sheet production includes a workbench and a grinding mechanism , the bottom of the workbench is provided with four sets of legs, and the grinding mechanism is installed on the top of...

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Problems solved by technology

[0002] As we all know, ceramic chips are an important part of semiconductor refrigeration chips. When processing ceramic chips, it is necessary to polish the ceramic chips to improve the quality of semiconductor cooling chips. The substrate processing device for semiconductor cooling chips is a kind of During the production and processing of refrigerating sheets, the device used to polish ceramic sheets has been widely used in the field of semiconductor refrigerating sheet production; the existing substrate processing device for refrigerating sheet production includes a workbench and a grinding mechanism , the bottom of the workbench is provided with four sets of legs, and the grinding mechanism is installed on the top of the workbench; when the existing substrate processing device for semiconductor refrigeration chip production is used, the staff starts the grinding mechanism on the top of the workbench, and then the staff will The surface to be polished of the ceramic chip is polished close to the grinding mechanism, and then the other side of the ceramic chip can be polished; in the use of the existing substrate processing device for the production of semiconductor refrigeration chips, it is found that grinding the ceramic chip face by face is more efficient. At the same time, due to human factors, it is difficult to make the two polished surfaces of the ceramic tile have a high parallelism, resulting in poor practicability

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