Unlock instant, AI-driven research and patent intelligence for your innovation.

POP packaging structure and packaging method

A packaging structure and packaging method technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of large packaging structure, complicated packaging process, etc., and achieve the effect of improving integration

Inactive Publication Date: 2020-11-20
HUATIAN TECH XIAN
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art, and provide a POP packaging structure and packaging method to solve the technical problems that the packaging structure in the POP technology in the prior art is relatively large and the packaging process is relatively complicated.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • POP packaging structure and packaging method
  • POP packaging structure and packaging method
  • POP packaging structure and packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] The present invention is described in further detail below in conjunction with accompanying drawing:

[0036] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, and therefore cannot be construed as limiting the present invention; the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be construed as indicating or implying relative importance; in addition, unless otherwise Clearly stipulated and limited, the terms "installation"...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a POP packaging structure and a packaging method. According to the structure, the lower chip is reversely mounted on the reverse side of the substrate, the reverse side of thesubstrate is directly bonded with the front side of the lower chip and bonded with a device, then internal components and parts and the lower chip are protected through plastic packaging, grinding andrewiring, and circuit connection between the internal components and the chip is realized. And then mounting of an upper chip and mounting of a device can be performed on the front surface of the substrate, so that a novel POP structure is formed. Due to the fact that no ball is planted in the structure, electric connection is achieved through the wiring layer of the lower plastic package structure, the integration degree of POP packaging is improved, the packaging process of a whole POP product is shortened, and the requirement that the integration degree of components in the packaging industry is continuously improved is met.

Description

【Technical field】 [0001] The invention belongs to the technical field of packaging, and in particular relates to a POP packaging structure and a packaging method. 【Background technique】 [0002] With the advent of the 5G era, large-capacity, small-volume, and highly-integrated SIP (system-in-package) technology has become the trend of semiconductor packaging technology. Advanced packaging technology must enable a single package to be packaged more and more without changing the package size. The more devices and chips, under this condition, POP (Package on Package) technology came into being to cope with this technology development trend, so that a single package can package more chips and devices, but the existing POP technology Because the ball planting operation still needs to be performed on the back of the substrate, the overall structure of the structure is too large, and the packaging process is complicated. 【Content of invention】 [0003] The purpose of the present...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/31H01L21/50H01L21/56
CPCH01L25/16H01L23/3128H01L21/50H01L21/56H01L2224/18H01L2224/32225H01L2224/16225H01L2224/73204H01L2224/73257H01L2224/73207H01L2924/00
Inventor 张婕马晓建苏亚兰
Owner HUATIAN TECH XIAN