Built-in buffer adsorption module
A built-in, modular technology, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve problems affecting product quality, damage, component deformation, etc., to achieve simple and ingenious structure, ensure balanced adsorption, and firm absorption Effect
Pending Publication Date: 2020-11-27
SUZHOU LINGYU ELECTRONICS TECH CO LTD
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Problems solved by technology
During the process of mechanically clamping the above parts, it is easy to deform or damage the parts, which will affect the product quality
Method used
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Embodiment Construction
[0029] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0030] Figure 1-2 Schematically shows a built-in buffer adsorption module according to an embodiment of the present invention, including a mounting plate 1, a driver 2, a buffer assembly 3, a pressure block 4, a cover plate 5, several first buffer springs 6 and Several suction rods 7; the fixed end of the driving part 2 is arranged on the mounting plate 1, and the pressure block 4 is arranged on the driving end of the driving part 2 through the buffer assembly 3; the pressure block 4 is provided with some guide holes 41, and several suction rods 7 It is movably arranged in several guide holes 41, the cover plate 5 is set on the pressure block 4, the first buffer spring 6 is sleeved outside the suction rod 7, and the first buffer spring 6 acts between the suction rod 7 and the cover plate 5 . In this embodiment, the driving part 2 is an air slide table.
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The invention discloses a built-in buffer adsorption module which includes a mounting plate, a driving part, a buffer assembly, a pressing block, a cover plate, a plurality of first buffer springs anda plurality of suction rods. The fixed end of the driving part is arranged on the mounting plate, and the pressing block is arranged at the driving end of the driving part through the buffer assembly. The pressing block is provided with a plurality of guide holes, and the suction rods are respectively and movably arranged in the guide holes. The cover plate is arranged on the pressing block, thefirst buffer springs sleeve the suction rods, and the first buffer springs act between the suction rods and the cover plate. According to the built-in buffer adsorption module with a buffer function,the structure adopts the suction rods, the suction rods are hidden in the pressing block, the first springs are arranged for buffering, and the structure is very simple and ingenious; moreover, the pressing block is equipped with the buffer assembly to ensure balanced adsorption of a workpiece, and the workpiece is prevented from being crushed; and the module is a product specially made for CNC orinjection molding or stamping process in the 3C industry, and can suck products smoothly, closely and firmly.
Description
technical field [0001] The invention relates to the technical field of automatic loading and unloading modules and devices, in particular to a built-in buffer adsorption module. Background technique [0002] The mobile phone has a variety of functional modules, which need to be assembled one by one. Components such as cameras and flashlights are small in size and precise in structure. Usually, multiple components are fixed on the same diaphragm for storage and transportation. When they need to be used, they are picked up by a robot and assembled. During the process of mechanically clamping the above components, the components are likely to be deformed or damaged, affecting product quality. [0003] Therefore, how to realize the damage-free and stable retrieving of small or precise parts is a technical problem to be solved urgently by those skilled in the art. Contents of the invention [0004] According to one aspect of the present invention, a built-in buffer adsorption...
Claims
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CPCB23P19/007
Inventor 陈瑶韦斌
Owner SUZHOU LINGYU ELECTRONICS TECH CO LTD