Semiconductor chip grinding and polishing method and grinding and polishing system
A semiconductor and chip technology, applied in the field of semiconductor chip grinding and polishing methods and grinding and polishing systems, can solve problems such as low grinding and polishing efficiency, and achieve the effects of reducing labor and material costs, reducing grinding and polishing time, and improving efficiency
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no. 1 example
[0047] refer to figure 1 , figure 1 It is a flow chart of the first embodiment of the semiconductor chip grinding and polishing method of the present invention. In this embodiment, the semiconductor chip grinding and polishing method includes the following steps:
[0048] Step S10: using a hot melt adhesive to fix the slice of the semiconductor chip on the abrasive tool;
[0049] Step S20: According to the order of particle size from coarse to fine, use five types of sandpaper to sequentially grind the slices of the semiconductor chip on the abrasive tool;
[0050] Step S30: Polishing the semiconductor chip slices after five times of grinding with a preset polishing liquid.
[0051] In this embodiment, in the process of using hot-melt adhesive to fix the slice of the semiconductor chip on the grinding tool: (1) if the sample is taken from the wafer, the grinding tool can be directly placed on the heating plate to heat, and then the grinding tool can be heated on the grinding...
Embodiment 2
[0058] refer to figure 2 , figure 2 It is a flowchart of the second embodiment of the semiconductor chip grinding and polishing method of the present invention, and proposes the second embodiment of the semiconductor chip grinding and polishing method of the present invention based on the first embodiment. In this embodiment, the semiconductor chip grinding and polishing method includes the following steps:
[0059] Step S11: using a hot melt adhesive to fix the semiconductor chip slice on the abrasive tool;
[0060] Step S12: Determine the grinding distance or grinding time corresponding to different sandpapers among the five kinds of sandpapers;
[0061] Step S13: Based on the determined grinding distance or grinding time, according to the order of particle size from coarse to fine, use five types of sandpaper to sequentially grind the semiconductor chip slices on the abrasive tool to the corresponding grinding distance or grinding time;
[0062] Step S14: Polishing the...
Embodiment 3
[0068] refer to image 3 , image 3 It is a flow chart of the third embodiment of the semiconductor chip grinding and polishing method of the present invention. A third embodiment of the semiconductor chip grinding and polishing method of the present invention is proposed based on the first embodiment. In this embodiment, the semiconductor chip grinding and polishing method includes the following steps:
[0069] Step S21: using a hot melt adhesive to fix the semiconductor chip slice on the abrasive tool;
[0070] Step S22: According to the order of particle size from coarse to fine, use five kinds of sandpaper to sequentially grind the semiconductor chip slices on the abrasive tool;
[0071] Step S23: Determine the polishing time corresponding to the preset polishing solution based on the wear condition of the semiconductor chip slice after grinding and the historical polishing condition;
[0072] Step S24: Using a preset polishing solution to polish the ground semiconduct...
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Abstract
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