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Method of manufacturing a photovotaic module

A photovoltaic module and sealant technology, applied in photovoltaic power generation, chemical instruments and methods, electronic equipment, etc., can solve problems such as module stripping

Pending Publication Date: 2020-11-27
CSEM CENT SUISSE DELECTRONIQUE & DE MICROTECHNIQUE SA RECH & DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So module stripping can also happen

Method used

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  • Method of manufacturing a photovotaic module
  • Method of manufacturing a photovotaic module
  • Method of manufacturing a photovotaic module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067]

[0068] [table 3]

[0069] Table 3 details the formulation of this example, where "phr" refers to parts per hundred resin. First, the antioxidant and the UV stabilizer were mixed into an additive masterbatch by a twin-screw extruder at 170°C. The mixture of base resin, catalyst masterbatch and additive masterbatch was then extruded through a single screw extruder at 170°C into a 0.5 mm thick film. The extruded films were then tested in a series of characterization steps.

[0070] The film was first laminated between two glass plates, each 3 mm thick, at 85° C. in a standard flat-bed vacuum bag laminator with a total cycle time of 60 minutes. The resulting laminate was free of voids and other visible defects. The post-lamination peel strength between foil and glass was measured to be in excess of 10 N / mm by a standard 90° peel test using a standard tensile tester. Standard creep tests were then performed on the laminated glass panels at 85°C and 85% relative humi...

Embodiment 2

[0072]

[0073] [Table 4]

[0074] Table 4 details the recipe for this example. First, the antioxidant, UV absorber and UV stabilizer were mixed into an additive masterbatch by a twin-screw extruder at 170°C. The base resin (in this case comprising a 50:50 blend of two different resins as indicated in the table), catalyst masterbatch and additive masterbatch were then passed through a single screw extruder at 170°C. The mixture was extruded into a 0.5 mm thick film. The extruded films were then tested in a series of characterization steps.

[0075] The film was first laminated between two glass plates, each 3 mm thick, at 85° C. in a standard flat-bed vacuum bag laminator with a total cycle time of 60 minutes. The resulting laminate was free of voids and other visible defects. After lamination, the peel strength between foil and glass was measured to exceed 5 N / mm by the standard 90° peel test as described above. Standard creep testing (as described above) was then per...

Embodiment 3

[0077]

[0078] [table 5]

[0079] Table 5 details the recipe for this example. First, the antioxidant, UV absorber and UV stabilizer were mixed into an additive masterbatch by a twin-screw extruder at 170°C. The mixture of base resin, catalyst masterbatch and additive masterbatch was then extruded through a single screw extruder at 170°C into a 0.5 mm thick film. The extruded films were then tested in a series of characterization steps.

[0080] The film was first laminated between two glass plates, each 3 mm thick, at 85° C. in a standard flat-bed vacuum bag laminator with a total cycle time of 60 minutes. The resulting laminate was free of voids and other visible defects. After lamination, the peel strength between foil and glass was measured to exceed 5 N / mm by the standard 90° peel test as described above. The laminated glass panels were then subjected to the same creep test as above at 85°C and 85% relative humidity, showing no creep after 100 hours.

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Abstract

Method of manufacturing a photovoltaic module (1) comprising at least a first layer and a second layer affixed to each other by means of an encapsulant, said method comprising steps of: providing a lamination device (33); disposing said first layer in said lamination device (33), disposing upon said first layer an encapsulant material manufactured by the steps of: providing a base resin comprisinga silane-modified polyolefin and having a melting point below 90 DEG C, forming a mixture of said base resin and an additive comprising a crosslinking catalyst, said cross-linking catalyst being present in a proportion of 0.01 to 5 parts per hundred of resin, melting said mixture at a temperature between 90 DEG C and 190 DEG C, preferably between 160 DEG C and 180 DEG C and extruding said mixtureto form said encapsulant material; disposing said second layer upon said encapsulant material, laminating said first layer, said second layer and said encapsulant material under application of heat and pressure, said heat being applied at a temperature between 60 DEG C and 125 DEG C, preferably between 60 DEG C and 100 DEG C, further preferably between 70 DEG C and 90 DEG C so as to crosslink said base resin.

Description

technical field [0001] The invention relates to the technical field of photovoltaic devices. More specifically, the present invention relates to a method of manufacturing a photovoltaic module suitable for use with highly temperature sensitive photovoltaic devices. Background technique [0002] Photovoltaic (PV) devices, also known as solar panels, photovoltaic modules, etc., are typically manufactured by laminating multiple components together under heat and pressure in a lamination These components are held together by layers of sealant adhered to external materials such as the so-called front cover (usually glass) and back cover (usually backplane or rear glass). Such sealant layers are usually based on thermoplastic and / or cross-linked resins such as ethylene vinyl acetate (EVA), silicone, urethane, polyvinyl butyral (PVB), thermoplastic silicone elastomers ( TPSE), ionomer, polyolefin (PO) or any other convenient polymer. [0003] Standard lamination temperatures are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/048H01L31/18
CPCH01L31/048H01L31/0481H01L31/18Y02E10/50B32B37/06B32B37/10B32B37/153B32B2309/02B32B2323/00B32B2457/12H01L31/186
Inventor 李恒宇J·埃斯卡拉·帕劳K·索德尔斯特罗姆L-E·佩雷特-埃比C·巴利夫
Owner CSEM CENT SUISSE DELECTRONIQUE & DE MICROTECHNIQUE SA RECH & DEV
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