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A kind of ultraviolet-heat dual-curing adhesive and its application

An adhesive, dual-curing technology, applied in the direction of adhesives, non-polymer organic compound adhesives, adhesive types, etc., can solve the problems of lens shifting, falling off, cracking, etc., to reduce curing shrinkage and improve resistance to cold and heat. The ability to shock and resist external force, the effect of preventing displacement

Active Publication Date: 2022-05-10
上海昀通电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the toughness of the adhesive layer is insufficient, it is easy to crack under the action of external force and thermal shock, which will cause the lens to shift or even fall off

Method used

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  • A kind of ultraviolet-heat dual-curing adhesive and its application
  • A kind of ultraviolet-heat dual-curing adhesive and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] This embodiment provides a UV-heat dual curing adhesive, comprising the following components in parts by weight:

[0070] 55 parts of cycloaliphatic epoxy resin, 25 parts of bisphenol A epoxy resin, 1 part of 3-ethyl-3-oxetanol, 1 part of styrene-butadiene rubber-acrylic resin core-shell toughener, polyamide 1 part of resin powder, 1 part of 1-hydroxycyclohexyl phenyl ketone, 5 parts of blocked hexafluoroantimonate and 1 part of fumed silica.

[0071] The preparation method of described ultraviolet-heat dual curing adhesive is as follows:

[0072] (1) 55kg cycloaliphatic epoxy resin, 25kg bisphenol A type epoxy resin, 1kg 3-ethyl-3-oxetanemethanol, 1kg styrene-butadiene rubber-acrylic resin core-shell toughener and 1kg polystyrene After the amide resin powder is weighed, drop into the mixing tank and stir, the stirring speed is set as 90rpm, and stirs for 10 minutes;

[0073] (2) Continue to add 5kg closed type hexafluoroantimonate (CXC-1612 of U.S. King's Industries ...

Embodiment 2

[0076] This embodiment provides a UV-heat dual curing adhesive, comprising the following components in parts by weight:

[0077] 30 parts of cycloaliphatic epoxy resin, 10 parts of bisphenol A epoxy resin, 10 parts of isobornyl acrylate, 10 parts of polybutadiene-acrylic resin core-shell toughener, 5 parts of polyamide resin powder, diphenyl 5 parts of ketone, 1 part of blocked hexafluoroantimonate and 2 parts of fumed silica.

[0078] The preparation method of described ultraviolet-heat dual curing adhesive is as follows:

[0079] (1) 30kg cycloaliphatic epoxy resin, 10kg bisphenol A type epoxy resin, 10kg isobornyl acrylate, 10kg polybutadiene-acrylic resin core-shell toughening agent and 5kg polyamide resin powder are weighed and dropped into Stir in the mixing tank, the stirring speed is set as 90rpm, and stir for 10 minutes;

[0080] (2) Continue to add 1kg closed type hexafluoroantimonate (KGI Applied Materials Co., Ltd. VicbaseTC3630) and 5kg benzophenone to stir in t...

Embodiment 3

[0083] This embodiment provides a UV-heat dual curing adhesive, comprising the following components in parts by weight:

[0084] 30 parts of cycloaliphatic epoxy resin, 25 parts of bisphenol A epoxy resin, 5 parts of isobornyl acrylate, 5 parts of polybutadiene-acrylic resin core-shell toughening agent, 3 parts of polymethyl methacrylate resin powder 2.5 parts of benzophenone, 2.5 parts of blocked hexafluoroantimonate and 5 parts of fumed silica.

[0085] The preparation method of described ultraviolet-heat dual curing adhesive is as follows:

[0086] (1) 30kg cycloaliphatic epoxy resin, 25kg bisphenol A type epoxy resin, 5kg isobornyl acrylate, 5kg polybutadiene-acrylic resin core-shell toughening agent and 3kg polymethyl methacrylate resin powder After weighing, put into the mixing tank and stir, the stirring speed was set at 90rpm, and stirred for 10 minutes;

[0087] (2) Continue to add 2.5kg of closed hexafluoroantimonate (Kage Applied Materials Co., Ltd. Vicbase TC3630...

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Abstract

The invention provides an ultraviolet-heat dual curing adhesive and its application. The adhesive comprises the following components in parts by weight: 40-80 parts of epoxy resin, 1-10 parts of reactive diluent, 1-10 parts of core-shell structure toughening agent, 1-5 parts of organic glass powder, and 1 part of photoinitiator ‑5 parts and thermal initiator 1‑5 parts. The adhesive provided by the present invention can be dual-cured by ultraviolet light and heat, which can not only quickly cure and position, but also ensure the final curing degree of the adhesive, prevent the uncured adhesive from contaminating the lens, and the adhesive has good thermal shock resistance and thermal shock resistance after curing. Anti-drop cracking performance, suitable for fixing optical lenses.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an ultraviolet-heat dual curing adhesive and its application. Background technique [0002] With the development of social economy and technology, portable mobile devices such as mobile phones and cameras are more and more widely used. The camera module is an important part of these devices. Now the pixels of the camera are getting higher and higher, and the high pixel can be realized through the chip. However, if the focus of the chip and the focus of the lens are inconsistent during the assembly process of the camera, the imaging effect will be reduced. [0003] The bonding between the traditional optical lens and the substrate is fixed by thermosetting glue. After the glue is dispensed, the workpiece is moved to an oven or an oven for heating and curing. During the heating process, the viscosity of the glue becomes lower when heated, which is equivalent to formi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08C09J4/06C09J4/02G02B7/02G02B7/18G03B30/00
CPCC09J163/00C09J11/04C09J11/08C09J4/06G02B7/025G02B7/1805C08L2205/025C08L2205/035C08L2207/53C08L63/00C08L9/06C08L33/00C08L77/00C08K7/26
Inventor 李孝伟蒋叶豪刘翘楚
Owner 上海昀通电子科技有限公司
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