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Loop-type heat pipe

A heat pipe and loop technology, applied in indirect heat exchangers, lighting and heating equipment, etc., can solve problems such as inability to move, impossible to cool heating components, and inability to perform heat transfer operations.

Pending Publication Date: 2020-12-01
SHINKO ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, since the working fluid changes from a liquid phase to a solid phase, it cannot move like a fluid and thus cannot perform heat transfer operations
As a result, it is impossible to cool heat-generating components

Method used

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  • Loop-type heat pipe
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] Hereinafter, embodiments will be described with reference to the accompanying drawings. Meanwhile, for the sake of convenience, characteristic parts of the drawings may be shown in an enlarged manner for easy understanding of features, and sizes and ratios of constituent elements may be different in respective drawings. In addition, in order to easily understand the cross-sectional structure of each member, the hatching of some members is shown in a satin pattern in the cross-sectional view, and the hatching of some members is omitted. Also, as used herein, "when viewed from above" means along image 3 View the target object in the vertical direction (up and down in the figure) etc., and the "plane shape" is indicated in image 3 The shape seen in the vertical direction of etc.

[0032] [structure]

[0033] figure 1 The illustrated loop heat pipe 1 is accommodated, for example, in mobile electronic devices 2 such as smartphones and tablet terminals. The loop heat p...

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PUM

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Abstract

The present invention provides a loop heat pipe comprising an evaporator configured to evaporate a working fluid; a condenser configured to condense the working fluid; a liquid pipe configured to connect the evaporator and the condenser; a vapor pipe configured to connect the evaporator and the condenser; a porous body provided in the liquid PIPE; and a vapor movement path provided at a part of the liquid pipe so as to be spaced apart from the porous body and extending from the evaporator in the longitudinal direction of the liquid pipe, in which the working fluid evaporated in the evaporatormoves. The vapor movement path has a flow path through which the working fluid evaporated in the evaporator moves, and a wall part surrounding the flow path.

Description

technical field [0001] The invention relates to a loop heat pipe. Background technique [0002] In the prior art, as a device configured to cool a heat-generating part of a semiconductor device (such as a CPU, etc.) mounted on an electronic device, a heat pipe configured to transfer heat by using a phase change of a working fluid has been proposed (For example, refer to PTL 1). [0003] The loop heat pipe includes an evaporating unit configured to receive heat from a heating element and evaporate a liquid-phase working fluid, and a condensing unit configured to condense a gas-phase working fluid through heat radiation. In addition, the loop type heat pipe includes a vapor pipe for flowing the working fluid evaporated in the evaporating unit into the condensing unit, and a liquid pipe for flowing the working fluid condensed in the condensing unit into the evaporating unit. The loop-type heat pipe has a loop-type structure in which an evaporation unit, a vapor pipe, a conden...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28D15/04
CPCF28D15/0266F28D15/04F28D15/046F28D15/0233F28D15/043
Inventor 町田洋弘仓岛信幸
Owner SHINKO ELECTRIC IND CO LTD