Wafer electrical property detection method

A detection method and electrical testing technology, applied in the direction of electronic circuit testing, circuits, measuring electricity, etc., can solve problems such as affecting the accuracy of test data, and achieve the effect of eliminating the influence of water vapor and improving the accuracy of measurement

Inactive Publication Date: 2020-12-04
HUA HONG SEMICON WUXI LTD
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  • Description
  • Claims
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Problems solved by technology

[0003] After water vapor is introduced on the surface of the pad, the contact resistance on the surface of the pad may change. When performing electrical tests on the wafer, the water vapor on the surface of the pad will affect the accuracy of the test data

Method used

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  • Wafer electrical property detection method

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Embodiment Construction

[0023] The technical solutions in this application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0024] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific orientati...

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Abstract

The invention discloses a wafer electrical property detection method, and relates to the field of semiconductor manufacturing. The wafer electrical property detection method comprises the following steps: carrying out heat treatment on a wafer to remove water vapor from the surface of a bonding pad on the wafer; and placing the wafer on an electrical property detection machine table to test electrical property of the wafer. The problem that electric leakage parameters and other electrical parameters tested by a wafer affected by water vapor at present are inaccurate is solved; and the effectsof eliminating the water vapor influence and improving the electrical parameter measurement accuracy are achieved.

Description

technical field [0001] The present application relates to the field of semiconductor manufacturing, and in particular to a wafer electrical detection method. Background technique [0002] During the manufacturing process of semiconductor devices, performance tests are performed on semiconductor devices at different stages to determine whether the performance of semiconductor devices meets expectations. Before the semiconductor device is packaged, there will be some wet processes, such as washing to remove defects, or the environment itself has a lot of water vapor, which will affect the pads on the wafer and introduce water vapor into the surface of the pads. [0003] After water vapor is introduced on the surface of the pad, the contact resistance on the surface of the pad may change. When performing electrical tests on the wafer, the water vapor on the surface of the pad will affect the accuracy of the test data. Contents of the invention [0004] In order to solve the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66G01R31/26G01R31/28
CPCH01L22/14G01R31/2831G01R31/2601
Inventor 闫玉琴程刘锁米魁范晓王函陈广龙
Owner HUA HONG SEMICON WUXI LTD
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