Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Rubberizing device of circuit board rubberizing machine

A glue sticking device and circuit board technology, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as difficult operation, and achieve the effects of avoiding the influence of resistance, improving positioning accuracy, and improving pasting quality

Inactive Publication Date: 2020-12-04
葛林刚
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of difficult operation of pasting adhesive paper on circuit boards in the prior art, and to propose a gluing device of a circuit board gluing machine with high gluing efficiency and simple gluing action

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rubberizing device of circuit board rubberizing machine
  • Rubberizing device of circuit board rubberizing machine
  • Rubberizing device of circuit board rubberizing machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] Such as Figure 1-Figure 6 As shown, a circuit board gluing machine includes a frame 1 and a delivery device 2 installed on the frame 1, a gluing device 3 and a gluing device 4; the delivery device 2 is arranged at the middle part of the frame 1, and the described The gluing device 3 is located above the conveying device 2, and the discharge end of the conveying device 2 is connected with the gluing device 4; the conveying device 2 is used to place the circuit board and transport the circuit board, and the gluing device 3 is used for In order to apply adhesive paper to the edge of the circuit board, the glue coating device 4 is used to wrap the adhesive paper on the edge of the circuit board. The above-mentioned gluing device 3 is a gluing device of a circuit board gluing machine.

[0025] Such as Figure 2-Figure 6 As shown, the conveying device 2 includes a base plate 21, a first side rail assembly 22, a second side rail assembly 23, a screw assembly 24, an end stop...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of circuit board rubberizing. The rubberizing device of circuit board rubberizing equipment comprises a moving module, a rubberizing assembly and a visualassembly, wherein a winding wheel is rotationally connected to a mounting plate, one end of a swing material passing plate is hinged to the mounting plate, a roller is arranged at the other end of theswing material passing plate, the swinging material passing plate is hollow, the fixed end of an adhesive paper pasting air cylinder is hinged to the mounting plate, the telescopic end of the adhesive paper pasting air cylinder is hinged to the middle of the swing material passing plate, an adhesive paper pressing air cylinder is obliquely installed on the mounting plate, a telescopic connectingframe is arranged at the telescopic end of the adhesive paper pressing air cylinder, an adhesive paper pressing roller is hinged to the telescopic connecting frame, and a paper cutting mechanism is arranged on the side of the mounting plate and corresponds to the position between the roller and the adhesive paper pressing roller. The rubberizing device has the advantages of being high in rubberizing efficiency and simple in rubberizing action.

Description

technical field [0001] The invention relates to the technical field of circuit board gluing, in particular to a gluing device of a circuit board gluing machine. Background technique [0002] In the circuit board surface treatment-gold process, because the gold salt is expensive, the copper surface of the exposed non-functional area needs to be covered to reduce the cost, especially for the large area of ​​bare copper on the edge (copper wrapping) of the circuit board. If it is not covered, the copper surface on the edge of the board will chemically react with the gold salt solution to add gold, which will consume a large amount of expensive gold salt, such as Figure 7 As shown, the edge of the circuit board 100 needs to be pasted with the adhesive tape 200 in the state shown in the figure. The general practice in the industry is to paste high-temperature-resistant blue tape on the edge of the circuit board, which needs to be glued and peeled off. The production cycle is long...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00H05K2203/1377H05K2203/1383
Inventor 葛林刚万香兰万小省
Owner 葛林刚
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com