Method for treating substrate and apparatus for treating substrate

A technology for substrates and treatment liquids, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of spending a lot of time and reducing drying time, and achieve the effect of improving drying efficiency and improving drying efficiency

Pending Publication Date: 2020-12-11
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the processing liquid is removed from the substrate W by drying the substrate W after treating the substrate W with the processing liquid, it takes a lot of time to dry the substrate W in the case where a large amount of the processing liquid remains on the substrate W.
If a small amount of treatment liquid is used to treat the substrate W to reduce the drying time, the liquid remaining on the substrate W cannot be sufficiently replaced by the treatment liquid

Method used

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  • Method for treating substrate and apparatus for treating substrate
  • Method for treating substrate and apparatus for treating substrate
  • Method for treating substrate and apparatus for treating substrate

Examples

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Embodiment Construction

[0058] Hereinafter, embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. However, inventive concepts may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. In the drawings, the size of elements is exaggerated for clarity of illustration.

[0059] figure 1 is a schematic plan view illustrating a substrate processing apparatus according to an embodiment of the inventive concept.

[0060] refer to figure 1 , the substrate processing apparatus may include an index module 10, a processing module 20, and a controller (not shown). According to an embodiment, the indexing module 10 and the processing module 20 may be arranged in one direction. Hereinafter, the direction in which the in...

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Abstract

Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the dryingstep, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processingis performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central regionof the substrate when the liquid processing is completed in the liquid processing chamber.

Description

[0001] This application is a divisional application of a Chinese invention patent application with a filing date of November 29, 2018, an application number of 201811444702.3, and a title of "Apparatus and Method for Processing a Substrate". technical field [0002] Embodiments of the inventive concepts described herein relate to apparatus and methods for processing a substrate, and more particularly, to apparatus and methods for processing a substrate with a liquid supplied onto the substrate and subsequently removing the liquid. Background technique [0003] Semiconductor processes include processes for cleaning thin films, foreign substances, particles, etc. on substrates. The cleaning process is performed by placing the substrate on the spin head so that the pattern side faces up or down, supplying a treatment liquid onto the substrate while the spin head rotates, and drying the substrate. [0004] Currently, supercritical fluids are used in the process of cleaning subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67051H01L21/67034H01L21/67028H01L21/6719H01L21/67742H01L21/67196H01L21/6875H01L21/02052H01L21/02041H01L21/02307H01L21/68764H01L21/02057H01L21/02101H01L21/6715H01L21/68707
Inventor 李龙熙李暎熏郑镇优林义相
Owner SEMES CO LTD
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