Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Infrared temperature measurement module based on thermopile

A technology of infrared temperature measurement and thermopile, applied in the direction of electric radiation detector, measuring device, optical radiation measurement, etc., can solve the problems that the temperature data cannot be adjusted in multiples, the initial data environment has large interference, and the lack of distance conversion mechanism, etc., to achieve Avoid moisture damage, reduce the burden of carrying, and reduce the overall size

Inactive Publication Date: 2020-12-18
深圳铯敏发科技有限公司
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned patents have the following shortcomings: the lack of a distance conversion mechanism, resulting in the inability to adjust the multiples of the temperature data collected at a long distance, which makes the temperature value calculated based on the data deviate greatly from the actual situation, and the distance conversion cannot be realized. The initial data obtained by the instrument is greatly disturbed by the environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Infrared temperature measurement module based on thermopile
  • Infrared temperature measurement module based on thermopile
  • Infrared temperature measurement module based on thermopile

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The technical solution of this patent will be further described in detail below in conjunction with specific embodiments.

[0029] Embodiments of the present patent are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are only used for explaining the patent, and should not be construed as limiting the patent.

[0030] In the description of this patent, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientation or positional relationship indicated by "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this patent and simplifying the des...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an infrared temperature measurement module based on a thermopile, and relates to the technical field of body temperature measurement. The invention aims to solve the problem that temperature measurement is greatly influenced by the distance. The module specifically comprises a core assembly and a placement assembly; the core assembly comprises a device box and an MCU processor control panel; and a thermopile infrared sensing chip, a distance sensing module, a high-precision NTC chip, a matching module and an external equipment interface are electrically installed on theouter wall of the top of the MCU processor control panel, wherein the thermopile infrared sensing chip is electrically connected with a thermopile infrared sensor, and the distance sensing module iselectrically connected with a distance sensor; and a driving module is arranged in the MCU processor control panel and comprises a temperature calculation program and an environment compensation program. The matching module can perform zooming-in or zooming-out processing on the human body temperature measured in a centimeter range, and is matched with an environment compensation program and a temperature calculation program, so that the measured temperature error is smaller than 0.1 DEG C.

Description

technical field [0001] The invention relates to the technical field of body temperature measurement, in particular to an infrared temperature measurement module based on a thermopile. Background technique [0002] Most of the existing infrared temperature measuring instruments directly use temperature sensors for data collection, but lack the corresponding compensation mechanism. A small number of temperature measuring instruments using thermopile technology also have the problem of limited environment, which needs to be solved systematically The above problems require a new type of infrared temperature measurement module based on thermopile. [0003] After searching, the Chinese patent application number is 201610100597.6, which discloses a non-contact switch cabinet contact infrared thermopile temperature measuring ring, including: a ring-shaped shell and an induction power-taking device located in the shell, storage The energy and power processing circuit, the signal acq...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/12G01J5/16G01J5/02G01B21/02
CPCG01B21/02G01J5/0205G01J5/12G01J5/16G01J2005/123
Inventor 廖伟华
Owner 深圳铯敏发科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com