Detection device for semiconductor

Abstract

The invention relates to the technical field of semiconductors, and discloses a semiconductor detection device. The device comprises a bottom plate, a supporting plate is fixedly connected to the upper surface of the bottom plate, a detection seat is fixedly connected to the upper surface of the supporting plate, and first fixed blocks are arranged on the left side and the right side of the back surface of the detection seat; the inner side surface of each first fixed block is fixedly connected with a first rotating shaft, the outer surface of the first rotating shaft is sleeved with a secondfixed block, the upper surface of the second fixed block is fixedly connected with a cover plate, and the front surface of the detection seat is provided with a locking device. According to the detection device for the semiconductor, through the arrangement of the fixed shaft, the second fixed block, the spring and the connecting shaft, the locking rod can conveniently and stably lock the fixing rod, so the cover plate and the detection seat can be stably and effectively driven to be connected, and the detection seat and the cover plate can accurately detect a QFP packaging integrated circuit,so the problem of deviation of a test result is effectively avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a detection device for semiconductors. Background technique [0002] A semiconductor is a substance whose conductivity is between an insulator and a conductor. Its conductivity is easy to control and can be used as a component material for information processing. Semiconductor materials are mostly used in the manufacture of chips. With the development of microelectronics technology, the weight is lighter, Chip technology with smaller size and high reliability is gradually being widely used. QFN is such a newer package form. It belongs to the device without lead package, and the size is very small. The common ones are 3*3mm and 4*4mm. , 5*5mm, 6*6mm, etc. The abdomen of the package usually has a grounding heat dissipation pad, and there are conductive pads around it for electrical connection. The number is usually 20, 24, 32, etc.; in the production of QFP packaged integrat...

AI Technical Summary

Problems solved by technology

[0002] A semiconductor is a substance whose conductivity is between an insulator and a conductor. Its conductivity is easy to control and can be used as a component material for information processing. Semiconductor materials are mostly used in the manufacture of chips. With the development of microelectronics technology, the weight is lighter, Chip technology with smaller size and high reliability is gradually being widely used. QFN is such a newer package form. It belongs to the device without lead package, and the size is very small. The common ones are 3*3mm and 4*4mm. , 5*5mm, 6*6mm, etc. The abdomen of the package usually has a grounding heat dissipation pad, and there are conductive pads around it for electrical connection. The number is usually 20, 24, 32, etc.; in the production of QFP packaged integrated circuits In the process, it is necessary to test the QFP packaged integrated circuit to avoid unqualified products from entering the market; the detection device in the prior art directly closes the cover plate and the bottom plate to detect the QFP packaged integrated circuit, and the connection between the cover plate and the bottom plate is poor, so it cannot be compared. Accurate detection of QFP packaged integrated circuits affects the precise contact between electrodes and pins, resulting in deviations in test results

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