Semiconductor test structure and quality test method of semiconductor passivation layer

Abstract

The invention provides a semiconductor test structure and a quality test method for a semiconductor passivation layer, the semiconductor test structure comprises: a first metal layer, the first metal layer includes at least one serpentine structure; an insulating layer covers the on the first metal layer and fill the gaps of the serpentine structure; the second metal layer is formed on the insulating layer, and the second metal layer includes two relatively interlaced comb structures, and two The comb teeth of the comb-shaped structure interpenetrate each other; the passivation layer covers the second metal layer and the insulating layer exposed by the comb-tooth gaps of the comb-shaped structure; a plurality of pads, respectively connected to both ends of the first metal layer and the second metal layer. The technical scheme of the invention can confirm in time whether there is a defect in the passivation layer, shortens the test cycle, and thus reduces the cost.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular to a semiconductor test structure and a quality test method for a semiconductor passivation layer. Background technique [0002] In the manufacturing process of the semiconductor device, a passivation layer (Passivation) is covered on the uppermost layer of the semiconductor device to protect the underlying structure from damage. However, factors such as the potential high stress of the passivation layer, interface delamination, and dielectric defects will make it sensitive to temperature changes, which will lead to cracks in the passivation layer during chip use, resulting in chip failure (metal interconnection disconnected wire, unsealed chip surface, etc.). Therefore, the industry reliability standard stipulates that a temperature cycle (TC, Temperature cycle) test is required for quality evaluation for the change of the passivation layer process. ...

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Problems solved by technology

[0003] However, the existing evaluation of the quality of the passivation layer is verified by the customer's cooperation with the temperature cycle experiment of the product level (that is, the finished product made through packaging and other processes), which has problems such as long verification period and high cost.

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