Tool applicable to de-bonding of wafers of multiple sizes
A debonding and multi-size technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to achieve the effect of satisfying multi-size
Pending Publication Date: 2020-12-18
苏州铼铂机电科技有限公司
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Problems solved by technology
[0005] In view of the above-mentioned defects in the prior art, the task of the present invention is to provide a tooling that can be applied to multi-size wafer debonding, and solve the problem that multi-size wafer debonding requires various matching size vacuum chucks and corresponding wafer stages.
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Embodiment Construction
[0013] The present invention will be further described below in conjunction with the examples, but not as a limitation of the present invention.
[0014] In order to better understand the present invention, please combine figure 1 As shown, the tooling applicable to the debonding of multi-size wafers involved in this embodiment includes a vacuum chuck 1 and a substrate table 2, one side of the disk surface of the vacuum chuck 1 is provided with several parallel linear grooves 11, and the middle one is located The linear grooves 11 are provided along the radial direction of the disk surface of the vacuum chuck 1 , and the linear grooves 11 on both sides thereof are arranged symmetrically. The surface of the vacuum chuck 1 is provided with a number of radially arranged linear vacuum suction grooves 12 and concentrically arranged circular vacuum suction grooves 13 , and vacuum suction grooves 14 are also provided on the surface of the vacuum chuck between adjacent linear grooves ...
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The invention discloses a tool applicable to de-bonding of wafers of multiple sizes. The tool comprises a vacuum chuck and a wafer bearing platform, a plurality of linear grooves are formed in one side of the surface of the vacuum chuck, the wafer bearing platform is arranged on one side, provided with the linear grooves, of the vacuum chuck, the wafer bearing platform is provided with a wafer bearing platform body, splicing finger parts matching the linear grooves are arranged on the side, close to the vacuum chuck, of the wafer bearing platform body, and the upper surfaces of the splicing finger parts are flush with the upper surface of the wafer bearing platform body and are higher than the upper surface of the vacuum chuck. According to the invention, the splicing finger parts bear thewafers pushed away from a substrate firstly, and the number of the splicing finger parts inserted into the linear grooves is utilized to satisfy the de-bonding process of wafers of multiple sizes.
Description
technical field [0001] The invention relates to a wafer debonding tool, in particular to a tool applicable to multi-size wafer debonding. Background technique [0002] In the back-end process of semiconductor wafers, the wafer is generally bonded to the sapphire substrate with a special wax. This process is called wafer bonding. After the bonding is completed, the back of the wafer is thinned and polished. , and then separate the wafer from the sapphire substrate, a process called debonding. In the process of debonding, the sapphire substrate bonded with the wafer needs to be heated. After the bonding wax is heated and melted, the viscosity and adhesion will be greatly reduced, and then the wafer is pushed away from the sapphire substrate by using a special pusher tool. Bottom, separate the two. [0003] When bonding, the same specification substrate is generally selected according to the wafer size, for example, a 3-inch wafer uses a 3-inch substrate, a 4-inch wafer uses ...
Claims
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IPC IPC(8): H01L21/67H01L21/683H01L21/687
CPCH01L21/67092H01L21/6838H01L21/68785
Inventor 谢华伟
Owner 苏州铼铂机电科技有限公司