LED display module and manufacturing method thereof, LED display screen and manufacturing method thereof

A technology of display module and manufacturing method, which is applied to instruments, electrical components, electrical solid devices, etc., can solve the problems of display effect, screen definition deterioration, cross-light and other problems, so as to alleviate cross-light problems, improve contrast, The effect of improving production efficiency

Pending Publication Date: 2020-12-25
HANGZHOU MULTI COLOR OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, due to the close distance between the chips of adjacent pixels, the light emitted by LEDs will affect each other when displaying, and the cross-light phenomenon is obvious, resulting in poor screen clarity and a great impact on the display effect

Method used

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  • LED display module and manufacturing method thereof, LED display screen and manufacturing method thereof
  • LED display module and manufacturing method thereof, LED display screen and manufacturing method thereof
  • LED display module and manufacturing method thereof, LED display screen and manufacturing method thereof

Examples

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Embodiment Construction

[0045] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various drawings, like elements are indicated with like reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown in the drawings.

[0046] In the following, many specific details of the present invention are described, such as structures, materials, dimensions, processes and techniques of components, for a clearer understanding of the present invention. However, the present invention may be practiced without these specific details, as will be understood by those skilled in the art.

[0047] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also i...

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PUM

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Abstract

The invention discloses an LED display module and a manufacturing method thereof, and an LED display screen and a manufacturing method thereof. The LED display module comprises a PCB, a plurality of groups of LEDs, an isolated gate, and a packaging layer, wherein the plurality of groups of LEDs are positioned on the first surface of the PCB and are electrically connected with the PCB, and each group of LED chips form a pixel point; the isolated gate is positioned on the first surface of the PCB, and each pixel point is separated by the isolated gate; and the packaging layer is positioned on the first surface of the PCB and covers each LED. According to the LED display module, all the pixel points are separated through the isolated gate structure, the problem of crosstalk between the adjacent pixel points is solved, and therefore the display effect is improved.

Description

technical field [0001] The present invention relates to the field of semiconductor packaging, more specifically, to an LED display module and a manufacturing method, an LED display screen and a manufacturing method. Background technique [0002] In recent years, LED (Light-Emitting Diode) displays are developing toward high resolution, which makes more and more pixels per unit area. However, the traditional SMD (Surface Mounted Devices) LED devices are used to assemble LED display screens by SMD, so they cannot meet the current high-resolution display requirements. Specifically, when the device is smaller, the packaging difficulty of a single chip device increases, and the corresponding cost increases; and as the number of patches increases geometrically, the assembly efficiency decreases; when the spacing between LEDs is smaller, especially when the dot pitch When the thickness is less than 800um, the difficulty of the placement process becomes more and more difficult, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/33H01L25/075
CPCG09F9/33H01L25/0753
Inventor 张汉春江忠永
Owner HANGZHOU MULTI COLOR OPTOELECTRONICS
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