Semiconductor process equipment and method for transferring wafers

A process equipment and semiconductor technology, applied in semiconductor/solid-state device manufacturing, metal material coating process, conveyor objects, etc., can solve the problems of cumbersome pallet replacement process, reduce equipment operation efficiency, etc., to improve operation efficiency and service life. The effect of lengthening and simplifying the replacement process

Pending Publication Date: 2020-12-25
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0003] The invention discloses a semiconductor process equipment and a method for transferring wafers, so as to solve the problems that the curr

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  • Semiconductor process equipment and method for transferring wafers
  • Semiconductor process equipment and method for transferring wafers
  • Semiconductor process equipment and method for transferring wafers

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[0037]In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described clearly and completely with reference to specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0038]The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0039]Please refer toFigure 1 to Figure 11The embodiment of the present invention discloses a semiconductor processing equipment. The disclosed semiconductor processing equipment includes a reacti...

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Abstract

The invention discloses semiconductor process equipment and a method for transferring wafers. The semiconductor process equipment comprises a reaction chamber and a loading and unloading chamber, wherein a tray and a supporting piece are arranged in the reaction chamber, the supporting piece is arranged on the bottom wall of the reaction chamber, the tray comprises a first sub-tray and a second sub-tray, the second sub-disc is arranged on the supporting piece, the first sub-tray is annular and is in lap joint with the second sub-tray, an annular groove is formed in the first sub-tray, after the first sub-tray is in lap joint with the second sub-tray, the bottom surface of the annular groove is flush with the top surface of the second sub-tray to form a wafer groove used for bearing a wafer, and the size of the second sub-tray is smaller than that of the wafer; and a first transfer assembly is arranged in the loading and unloading chamber. According to the scheme, the problems that thetray replacement procedure of existing semiconductor process equipment is tedious, and the operation efficiency of the equipment is reduced can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor process equipment and a method for transferring wafers. Background technique [0002] In the existing semiconductor process equipment, the transfer of wafers between the reaction chamber and the loading and unloading chamber is realized based on the transfer mechanism. The transfer mechanism usually includes a tray and a grabbing member. The grabbing member can carry out wafer transfer on the tray The pick-and-place operation and realize the transfer of the wafer. At present, the trays are fixed in a fixed way, and the cavity will be opened for replacement at the end of the service life of the tray. Not only is the operation process more cumbersome, but it will also cause the entire semiconductor equipment to suspend operation and reduce operating efficiency. Contents of the invention [0003] The invention discloses a semiconductor process ...

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Application Information

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IPC IPC(8): H01L21/673H01L21/677H01L21/67C23C16/458
CPCC23C16/4581H01L21/6719H01L21/67196H01L21/67333H01L21/67742H01L21/67766H01L21/67775
Inventor 刘凯
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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