Carrier plate type bare chip power amplifier module testing device
A technology of a power amplifier module and a testing device, which is applied in the directions of measuring devices, measuring device casings, and electronic circuit testing, etc., can solve the problems of difficult electrical performance index testing, fragile surface bare chips, and small circuit structure space, so as to avoid surface chip damage. Risk, low cost of testing, effect of ensuring reliability
Active Publication Date: 2021-01-05
SICHUAN SIAIPU ELECTRONICS TECH CO LTD
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Problems solved by technology
Due to the special structure of the carrier-type bare chip power amplifier module, the bare chip on the surface is extremely fragile and easily damaged, and the circuit structure space is small, so the electrical performance index test of this type of module is a difficult problem
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[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but the embodiments described in the present invention are some of the embodiments of the present invention, not all of them .
[0037] It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.
[0038] In describing the present invention, it should be noted that the terms "centre", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. indicate The orientation or positional relationship of the invention is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually p...
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The invention provides a carrier plate type bare chip power amplifier module testing device which comprises a sliding rail supporting block, the top face of the sliding rail supporting block is connected with a base body block, the end of the base body block is connected with a locking nut, the locking nut is in threaded connection with a pull rod, the end of the pull rod is rotationally connectedwith a wedge-shaped sliding block, and the wedge-shaped sliding block is matched with a supporting block. A low-frequency probe board comprises a probe base, the probe base is connected with a low-frequency control board, a multi-core connector is inserted into the low-frequency control board, a low-frequency patch cord is welded to the multi-core connector, and the other end of the low-frequencypatch cord is connected with an elastic probe; the surface of a first radio frequency circuit board is provided with a first radio frequency transmission line, and the surface of a second radio frequency circuit board is provided with a second radio frequency transmission line. The radio frequency elastic probe assembly is matched with the second radio frequency circuit board; a radio frequency coaxial assembly is horizontally arranged on the base block in a penetrating mode. According to the invention, rapid clamping of the power amplifier module is realized by adopting a novel structural design, and the electrical performance index test problem of the power amplifier module is solved.
Description
technical field [0001] The invention relates to the technical field of power amplifier module detection, in particular to a test device for a carrier-type bare chip power amplifier module. Background technique [0002] With the development of the times, the volume of radio frequency microwave circuits is getting smaller and smaller, and the power density is getting higher and higher. To cope with this trend, the application of carrier board bare chip power amplifier modules in radio frequency microwave circuits is becoming more and more extensive. Due to the special structure of the carrier board bare chip power amplifier module, the bare chip on the surface is extremely fragile and easily damaged, and the circuit structure space is small, so the electrical performance index test of this type of module is a difficult problem. Contents of the invention [0003] Aiming at the problems existing in the related prior art, the present invention provides a carrier-type bare-chip ...
Claims
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IPC IPC(8): G01R31/28G01R1/04G01R1/067
CPCG01R1/0408G01R1/0425G01R1/067G01R31/2822
Inventor 罗亮肖磊魏艾莉
Owner SICHUAN SIAIPU ELECTRONICS TECH CO LTD
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