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A positive low temperature curable photosensitive resin composition

A photosensitive resin, curing-type technology, applied in optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc., can solve the problems of unusable, unable to form organic insulating film, flexible substrate damage, etc., to achieve low Effect of temperature process, excellent moisture resistance and flexibility, excellent chemical resistance

Active Publication Date: 2021-07-02
上海玟昕科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case where the curing reaction occurs at a curing temperature of 230°C or higher, there is a problem that an organic insulating film cannot be formed on a substrate having a relatively high coefficient of thermal expansion or a low glass transition temperature (Tg)
Moreover, at high curing temperature, there is a problem that the flexible substrate is easily damaged and cannot be used

Method used

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  • A positive low temperature curable photosensitive resin composition
  • A positive low temperature curable photosensitive resin composition
  • A positive low temperature curable photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0110] After preparing a flask equipped with a mechanical stirrer, a thermometer, and a cooling jacket, 240 g of propylene glycol monomethyl ether and 100 g of bisphenol fluorene represented by Chemical Formula 1-1 were added under a nitrogen stream, and heated to 40° C. while stirring. After adding 0.288 g of dibutyltin dilaurate to the reaction liquid, the temperature of the reactor was raised to 65°C. While continuing to stir the reaction solution, 36.98 g of 4,4'-diphenylmethane diisocyanate was slowly added separately, and the absorption spectrum of the isocyanate group (2280 cm -1 ) disappeared, and 315.2 g of epichlorohydrin was added to the reaction liquid, followed by heating to 100° C. and stirring for 1 hour. To this reaction liquid, 33.8 g of methacrylic acid was added, and the temperature was raised to 110° C. to make it react for 3 hours. Thereafter, it was dissolved in tetrahydrofuran (THF), and after obtaining a precipitate with water, it was dissolved in dich...

Synthetic example 2

[0112] After preparing a flask equipped with a mechanical stirrer, a thermometer, and a cooling jacket, 240 g of propylene glycol monomethyl ether and 100 g of bisphenol fluorene represented by Chemical Formula 1-1 were added under a nitrogen stream, and heated to 40° C. while stirring. After adding 0.288 g of dibutyltin dilaurate to the reaction liquid, the temperature of the reactor was raised to 65°C. While continuing to stir the reaction solution, 36.98 g of 4,4'-diphenylmethane diisocyanate was slowly added separately, and the absorption spectrum of the isocyanate group (2280 cm -1 ) disappeared, and 315.2 g of epichlorohydrin was added to the reaction liquid, followed by heating to 100° C. and stirring for 1 hour. To this reaction liquid, 33.8 g of methacrylic acid was added, and the temperature was raised to 110° C. to make it react for 3 hours. Thereafter, it was dissolved in tetrahydrofuran (THF), and after obtaining a precipitate with water, it was dissolved in dich...

Synthetic example 3

[0114] After preparing a flask equipped with a mechanical stirrer, a thermometer, and a cooling jacket, 240 g of propylene glycol monomethyl ether and 100 g of bisphenol fluorene represented by Chemical Formula 1-1 were added under a nitrogen stream, and heated to 40° C. while stirring. After adding 0.288 g of dibutyltin dilaurate to the reaction liquid, the temperature of the reactor was raised to 65°C. While continuing to stir the reaction solution, 36.98 g of 4,4'-diphenylmethane diisocyanate was slowly added separately, and the absorption spectrum of the isocyanate group (2280 cm -1 ) disappeared, and 315.2 g of epichlorohydrin was added to the reaction liquid, followed by heating to 100° C. and stirring for 1 hour. To this reaction liquid, 33.8 g of methacrylic acid was added, and the temperature was raised to 110° C. to make it react for 3 hours. Thereafter, it was dissolved in tetrahydrofuran (THF), and after obtaining a precipitate with water, it was dissolved in dich...

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PUM

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Abstract

A positive low-temperature curable photosensitive resin composition, comprising an acrylic copolymer resin represented by Chemical Formula 1, a photosensitive agent composed of 1,2-diazidonaphthoquinone sulfonate compound, and a leveling agent , an additive and a solvent of at least one of curing agent and silane coupling agent. [chemical formula 1]

Description

technical field [0001] The invention relates to a low-temperature curable photosensitive resin composition. More specifically, it relates to a low-temperature-curable photosensitive resin composition capable of forming an insulating film pattern or a protective film pattern having excellent reliability (adhesion) and chemical resistance even under low-temperature process conditions according to the present invention. Background technique [0002] In the display field, the low-temperature-curable photosensitive resin composition is used to form a photocurable pattern of an insulating film, a protective film, and the like. Since the photosensitive resin composition contains a photosensitizer, the photosensitizer of the photosensitive resin composition decomposes and undergoes an acidification reaction when light is irradiated. [0003] The photosensitive resin composition is first coated on a substrate to form a photosensitive resin film. Afterwards, a photolithography proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039G03F7/004G09F9/30
CPCG03F7/004G03F7/039G09F9/301
Inventor 黄光锋李文武
Owner 上海玟昕科技有限公司
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