A negative low temperature curable photosensitive resin composition

A technology of photosensitive resin and composition, applied in optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc., to achieve the effects of excellent chemical resistance, excellent reliability, and low temperature process

Active Publication Date: 2021-07-09
上海玟昕科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Currently, low temperature curable photosensitive resin compositions have problems in curing reactivity under low temperature conditions, reliability (adhesion) of formed patterns, and chemical resistance.

Method used

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  • A negative low temperature curable photosensitive resin composition
  • A negative low temperature curable photosensitive resin composition
  • A negative low temperature curable photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0078] After preparing a flask equipped with a mechanical stirrer, a thermometer, and a cooling jacket, 240 g of propylene glycol monomethyl ether and 100 g of bisphenol fluorene represented by Chemical Formula 1-1 were added under a nitrogen stream, and heated to 40° C. while stirring. After adding 0.288 g of dibutyltin dilaurate to the reaction liquid, the temperature of the reactor was raised to 65°C. While continuing to stir the reaction solution, 36.98 g of 4,4'-diphenylmethane diisocyanate was slowly added separately, and the absorption spectrum of the isocyanate group (2280 cm -1 ) disappeared, and 315.2 g of epichlorohydrin was added to the reaction liquid, followed by heating to 100° C. and stirring for 1 hour. To this reaction liquid, 33.8 g of methacrylic acid was added, and the temperature was raised to 110° C. to make it react for 3 hours. Thereafter, it was dissolved in tetrahydrofuran (THF), and after obtaining a precipitate with water, it was dissolved in dich...

Synthetic example 2

[0080] After preparing a flask equipped with a mechanical stirrer, a thermometer, and a cooling jacket, 240 g of propylene glycol monomethyl ether and 100 g of bisphenol fluorene represented by Chemical Formula 1-1 were added under a nitrogen stream, and heated to 40° C. while stirring. After adding 0.288 g of dibutyltin dilaurate to the reaction liquid, the temperature of the reactor was raised to 65°C. While continuing to stir the reaction solution, 36.98 g of 4,4'-diphenylmethane diisocyanate was slowly added separately, and the absorption spectrum of the isocyanate group (2280 cm -1 ) disappeared, and 315.2 g of epichlorohydrin was added to the reaction liquid, followed by heating to 100° C. and stirring for 1 hour. To this reaction liquid, 33.8 g of methacrylic acid was added, and the temperature was raised to 110° C. to make it react for 3 hours. Thereafter, it was dissolved in tetrahydrofuran (THF), and after obtaining a precipitate with water, it was dissolved in dich...

Synthetic example 3

[0082] After preparing a flask equipped with a mechanical stirrer, a thermometer, and a cooling jacket, 240 g of propylene glycol monomethyl ether and 100 g of bisphenol fluorene represented by Chemical Formula 1-1 were added under a nitrogen stream, and heated to 40° C. while stirring. After adding 0.288 g of dibutyltin dilaurate to the reaction liquid, the temperature of the reactor was raised to 65°C. While continuing to stir the reaction solution, 36.98 g of 4,4'-diphenylmethane diisocyanate was slowly added separately, and the absorption spectrum of the isocyanate group (2280 cm -1) disappeared, and 315.2 g of epichlorohydrin was added to the reaction liquid, followed by heating to 100° C. and stirring for 1 hour. To this reaction liquid, 33.8 g of methacrylic acid was added, and the temperature was raised to 110° C. to make it react for 3 hours. Thereafter, it was dissolved in tetrahydrofuran (THF), and after obtaining a precipitate with water, it was dissolved in dichl...

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PUM

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Abstract

The low-temperature curable photosensitive resin composition includes: an acrylic copolymer resin represented by Chemical Formula 1; an acrylic multifunctional monomer having an acrylic acid ester with more than two functionalities; at least O-acyl oxime photoinitiator, benzene One of acetone photoinitiator and benzophenone photoinitiator; additive and solvent comprising at least one of silane coupling agent, leveling agent, thermal polymerization inhibitor and sensitizer, [chemical formula 1]

Description

technical field [0001] The invention relates to a negative low temperature curable photosensitive resin composition. More specifically, according to the present invention, it relates to a low-temperature curable photosensitive resin composition that has excellent curing reactivity even under low temperature conditions, can form a pattern with excellent reliability (adhesion), and is excellent in chemical resistance. Background technique [0002] In the display field, the low-temperature-curable photosensitive resin composition is used to form a photocurable pattern of an insulating film, a protective film, and the like. Specifically, the low-temperature curable photosensitive resin composition is selectively exposed and developed through the photolithography process to obtain the desired photocured pattern. In order to improve the process yield in this process, a photosensitive resin with high sensitivity is required. combination. [0003] The low-temperature curable photo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/033G03F7/027G03F7/004G09F9/30
CPCG03F7/004G03F7/027G03F7/033G09F9/301
Inventor 黄光锋李文武
Owner 上海玟昕科技有限公司
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