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FPC bonding pad design structure of bicrystal LED

A technology for designing structures and pads, which is applied to lighting and heating equipment, components of lighting devices, semiconductor devices of light-emitting elements, etc., can solve the problems of serious tin creeping on the side and rear, reduce tin creeping, improve welding effect, The effect of improving stability

Pending Publication Date: 2021-01-08
深圳市全正科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the serious problem of tin crawling on the side and rear during the welding of dual-crystal LEDs in the prior art, and propose a FPC pad design structure for dual-crystal LEDs

Method used

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  • FPC bonding pad design structure of bicrystal LED
  • FPC bonding pad design structure of bicrystal LED
  • FPC bonding pad design structure of bicrystal LED

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0023] refer to Figure 1-4 , an FPC pad design structure for a dual-crystal LED, including a pad body 1 and a dual-crystal lamp body 2, an inclined surface 13 is provided between the side and the lower end of the pad body 1, and the inclined surface 13 is a protruding arc surface , the upper side wall of the pad body 1 is provided with a concave surface 14, the concave surface 14 is located directly above the inclined surface 13, by setting the concave surface 14 and the inclined surface 13, it is more convenient when installing or disassembling the pad body 1, To reduce the burden on the staff, the side wall of the pad body 1 is provided with a welding area, and th...

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Abstract

The invention discloses a FPC bonding pad design structure of a bicrystal LED. The FPC bonding pad design structure comprises a bonding pad body and a bicrystal lamp body, wherein the side wall of thebonding pad body is provided with a welding area, the welding area comprises a first welding area, a plurality of second welding areas and a plurality of third welding areas, the side wall of the bonding pad body is provided with a plurality of welding parts, the multiple welding parts comprise a first welding part, a second welding part and a third welding part, the multiple first welding partsare connected with the multiple first welding areas respectively, the multiple second welding parts are connected with the multiple second welding areas respectively, the multiple third welding partsare connected with the multiple third welding areas respectively, the side wall of the bonding pad body is provided with an adding area, and the adding area comprises a plurality of first adding areas, a plurality of second adding areas and a plurality of third adding areas. According to the invention, the yield and the welding quality of the bicrystal lamp body can be improved, the stability of the bicrystal lamp body in use is improved, the service life of the bicrystal lamp body is prolonged, the structure is simple, and operation is convenient.

Description

technical field [0001] The invention relates to the technical field of pads, in particular to an FPC pad design structure of a dual crystal LED. Background technique [0002] In flow soldering, most of the solder at the soldering point climbs along the lead, and the solder between the lead to be soldered and the pad is insufficient or has no solder. It is also called core pulling phenomenon, which is one of the common welding defects. It is more common in vapor phase reflow soldering. Serious virtual soldering phenomenon formed between the pin and the chip body. [0003] In the existing technology, conventional LEDs generally only have the phenomenon of soldering at the bottom, while dual-crystal LEDs are LEDs with special structures. When welding dual-crystal LEDs, soldering is mainly caused by side and rear soldering. The welding quality of crystal LED affects the use effect. Therefore, we propose a FPC pad design structure of dual crystal LED to solve the above problems...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/18F21V19/00F21Y115/10
CPCF21V19/0025F21Y2115/10H05K1/118H05K1/18
Inventor 夏秀全石宇锋杜凯迪
Owner 深圳市全正科技有限公司