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led module and display device

A technology of LED modules and LED chips, applied in the fields of instruments, nonlinear optics, optics, etc., can solve the problems that the signal integrity and reliability of LED chips are greatly affected, the luminous effect of LED chips is affected, and the integration accuracy of drive chips is low. , to achieve the effect of improving the luminous effect, reducing the impedance and improving the integration accuracy

Active Publication Date: 2022-07-01
XIAMEN TIANMA MICRO ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the substrate of the LED module adopts a PCB board, since the PCB board mainly adopts the substrate material of the flame-resistant material grade FR4, due to the limitation of the process, the integration accuracy of the driver chip on the PCB board is low
When the substrate of the LED module uses a glass substrate, due to the limitation of the process, Mo / Al / Mo is usually used to form the signal wiring on the glass substrate. Due to the high resistivity of Al, the impedance of the signal wiring is too high, and the IR voltage is too high. The IR drop is large, which has a great impact on the integrity and reliability of the signal transmitted from the driver chip to the LED chip, and affects the luminous effect of the LED chip

Method used

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Embodiment Construction

[0021] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, the numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the invention unless specifically stated otherwise.

[0022] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0023] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods, and apparatus should be considered part of the specification.

[0024] In all examples shown and discussed herein, any specific values ​​should be construed as illustrative only and not limiting. Accordingly, other instances of the exemplary embodiment may hav...

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Abstract

The invention discloses an LED module and a display device, and relates to the field of display technology. The LED module comprises: an LED substrate, a driving substrate and a connection structure; the LED substrate comprises a PCB substrate, a plurality of first signal lines and are arranged in an array The LED chips and the first signal wiring are arranged on the PCB substrate with the PCB substrate as the substrate, and the first pole and the second pole of the LED chip are respectively connected to different first signal wirings; the driving substrate includes glass a substrate, a driving chip and a plurality of second signal wirings, the driving chip and the second signal wirings are arranged on the glass substrate with the glass substrate as the substrate, and one end of the second signal wiring is electrically connected to the driving chip; the first signal wiring is The wire and the second signal trace are electrically connected through the connection structure. The invention can effectively reduce the IR voltage drop of the signal line between the driving chip and the LED chip while improving the integration precision of the driving chip.

Description

technical field [0001] The present invention relates to the field of display technology, and more particularly, to an LED module and a display device. Background technique [0002] Regional dimming technology is a hot spot in the current display field. As a regional dimming backlight module for liquid crystal display panels, a light-emitting diode (Light Emitting Diode, LED) module is the core device of a regional dimming display device. Among them, the LED module The substrate generally adopts a printed circuit board (Printed Circuit Board, PCB board for short) or a glass substrate. The LED module also includes an LED chip, a driver chip (Integrated Circuit, IC for short), and an LED chip that is electrically connected to the LED chip. and the signal trace between the driver chip. [0003] When the substrate of the LED module adopts the PCB board, because the PCB board mainly uses the substrate material of the flame-resistant material grade of FR4, the integration accuracy...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13357
CPCG02F1/133603
Inventor 谢璐张学梅
Owner XIAMEN TIANMA MICRO ELECTRONICS
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