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Semiconductor process analysis system, analysis method, and computer-readable storage medium

An analysis method and semiconductor technology, applied in computer-aided design, calculation, instruments, etc., can solve the problems of cumbersome chart drawing work, reduce the workload of data comparison, improve the accuracy of analysis, and reduce the production workload.

Active Publication Date: 2022-04-26
CHANGXIN MEMORY TECH INC
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  • Abstract
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  • Application Information

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Problems solved by technology

[0005] The present invention provides a semiconductor manufacturing process analysis system, an analysis method, and a computer-readable storage medium to solve the problem of cumbersome chart drawing in the existing analysis process

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  • Semiconductor process analysis system, analysis method, and computer-readable storage medium

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Embodiment Construction

[0033] It can be seen from the background art that the current semiconductor process analysis method is complicated.

[0034] The analysis found that the current semiconductor process analysis method is based on the analysis of the traditional two-dimensional chip map system, which mainly focuses on a single batch (lot) of wafers, and supports all the data that can be displayed on the chip map system for this batch of wafers. In addition, in order to know the chip yield rate at different times, the yield rate analysis is mainly carried out by grabbing measurement values ​​to generate charts and comparisons. Therefore, the preparation of charts is cumbersome and increases the working time of users; at the same time, for multiple quantities The similar distribution of measured data should not be represented by graphs, which increases the difficulty of yield analysis; in addition, different batches of wafers experience the same process at different time points. For different batch...

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Abstract

The present invention relates to a semiconductor manufacturing process analysis system, an analysis method, and a computer-readable storage medium. The analysis method includes: establishing a chip map library, and the chip map library includes a plurality of chip maps sorted by a time axis, and the time axis represents different batches The wafer goes through the same process time, and the multiple chip maps are established for different batches of wafers that go through the same process, and the chip map represents the time that the wafer goes through the same process and the corresponding performance data; based on the chip map library, the performance Data distribution mode; based on the distribution mode of performance data, abnormal conditions of the process can be obtained. The embodiment of the present invention provides a brand-new analysis method, which is beneficial to improve analysis efficiency and analysis accuracy.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor manufacturing process analysis system, an analysis method, and a computer-readable storage medium. Background technique [0002] The semiconductor manufacturing stage can generally be divided into front-end process (FEOL, Front End of Line) and back-end process (BEOL, Back End of Line). A chip (die) of a circuit. [0003] How to improve the production yield and reduce the abnormal loss in the production process is the goal that every semiconductor factory has been pursuing. Before chip packaging, analyzing the performance of each chip on the wafer is helpful to feedback and analyze the abnormal factors existing in the semiconductor manufacturing process, so as to eliminate the abnormal factors, thereby improving the production yield and reducing the abnormal loss in the production process. [0004] However, the current semiconductor process analysis metho...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/392
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC