Apparatus and method for removing wafer from dicing tape attached to wafer frame
A technology for cutting tapes and wafers, applied in the field of chip manufacturing, can solve problems such as low efficiency, wafer cracking, pollution, etc., and achieve the effect of not being easy to pollute and improving efficiency
Active Publication Date: 2021-01-22
INTEL PROD CHENGDU CO LTD +1
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- Abstract
- Description
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- Application Information
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Problems solved by technology
Both of these methods are not only inefficient, but also have the risk of dropping the wafer and damaging it, contaminating the wafer with operator fingers, or cracking the wafer when it hits the wafer frame during peeling of the dicing tape
Method used
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Embodiment Construction
[0045] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood by those skilled in the art that these exemplary embodiments do not imply any limitation to the present invention.
[0046] figure 1 A wafer frame is shown schematically. Such as figure 1 As shown, the wafer frame 1 includes a generally circular frame body 3, and a pair of straight cut portions 5 are oppositely formed on the periphery of the frame body 3, so that the circular frame body 3 can be positioned relative to the supporting device (not shown). shown) remains fixed and does not rotate.
[0047] figure 2 A wafer frame is schematically shown with a wafer attached thereto by dicing tape. Such as figure 2 As shown, the dicing tape 7 is attached to the frame body 3 , and the wafer 9 is adhered to the dicing tape 7 attached to the frame body 3 . The wafer frame 1 with the wafer 9 adhered by the dicing tape 7 is t...
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An apparatus and method for removing a wafer from a dicing tape attached to a wafer frame are provided. The apparatus includes a carrier plate disposed on a support and configured to carry the wafer;a first vacuum generation device which is communicated with the through hole in the bearing disc through a first pipeline, wherein when the wafer is borne on the bearing disc, the first vacuum generation device can generate vacuum in a space formed by the bearing disc and the wafer; an adsorption gun which is provided with a suction nozzle for adsorbing the wafer; and a second vacuum generation device which is communicated with the adsorption gun through a second pipeline. According to the invention, not only is the efficiency remarkably improved, but also the wafer is not easy to fall off tobe damaged, fingers of an operator are not easy to pollute the wafer, and the wafer does not move to collide with the wafer frame to be cracked in the process of stripping the cutting adhesive tape.
Description
technical field [0001] The present invention relates to the manufacture of chips, and more particularly to an apparatus and method for removing a wafer from a dicing tape attached to a wafer frame. Background technique [0002] Wafer bonding is an important step in the chip manufacturing process before the wafer is diced into individual dies (also called wafers or dies). In the wafer attach step, the dicing tape is attached to the wafer frame (also called an attach ring) first, and then the wafer is attached to the dicing tape. Through the wafer attach step, both the wafer and the wafer frame are attached to the adhesive layer on the surface of the dicing tape. During the wafer placement process, sometimes there are air bubbles or particles between the wafer and the dicing tape, the dicing tape is wrinkled, the dicing tape is too tight or loose, the dicing tape is scratched, cracked or otherwise damaged, the wafer Quality problems such as the eccentricity of the circle rel...
Claims
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IPC IPC(8): H01L21/683
CPCH01L21/6836H01L21/6838H01L2221/68381
Inventor 冯跃华敬世美
Owner INTEL PROD CHENGDU CO LTD