A high-performance wide-range temperature-sensitive thin-film pressure-sensitive chip
A pressure-sensitive chip and wide-range technology, which is applied in the field of temperature-sensitive thin-film pressure-sensitive chips based on high-performance, wide-range, and can solve problems such as poor anti-interference performance, and achieve the effects of improving accuracy, good anti-interference ability, and stable transmission.
Inactive Publication Date: 2021-05-07
NANHUA UNIV
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Problems solved by technology
[0004] For this reason, the present invention provides a temperature-sensitive thin-film pressure-sensitive chip based on high-performance wide-range band to overcome the problem of poor anti-interference of pressure-sensitive chips in the prior art
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[0121] In order to make the objects and advantages of the present invention clearer, the present invention will be further described below in conjunction with the examples; it should be understood that the specific examples described here are only for explaining the present invention, and are not intended to limit the present invention.
[0122] Preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present invention, and are not intended to limit the protection scope of the present invention.
[0123] It should be noted that, in the description of the present invention, terms such as "upper", "lower", "left", "right", "inner", "outer" and other indicated directions or positional relationships are based on the terms shown in the accompanying drawings. The direction or positional relationship shown is ...
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The invention relates to a temperature-sensitive thin-film pressure-sensitive chip based on high performance and wide range, which includes a substrate, a base body and an anti-interference cover. The interference cover is fixedly connected to the substrate through a buckle mechanism. The buckle mechanism includes an upper clamping rod and a lower clamping rod; the high-performance wide-range temperature-sensitive thin-film pressure-sensitive chip uses the elastic force of the first spring to lock the upper clamp The clips on the connecting rod and the lower clamping rod are engaged with each other, so that the anti-interference cover is fixed to the base plate. There is an anti-interference layer inside the anti-interference cover to block external interference. In addition to isolating the function of external signal interference, the anti-interference cover In addition, it can also be used to eliminate static electricity and make the substrate work normally. By pressing the pressing head, the clips on the upper clamping rod and the lower clamping rod are separated from each other, and the anti-interference cover can be drawn out. The structure of the anti-interference cover is simple and convenient. Disassemble.
Description
technical field [0001] The invention relates to the field of chip technology, in particular to a high-performance wide-range temperature-sensitive film pressure-sensitive chip. Background technique [0002] At present, the global sensor market has reached 170 billion US dollars, of which the pressure sensor market has reached 32 billion US dollars, and continues to grow at a rate of more than 20% per year. Pressure-sensitive chips are the core components of pressure sensors. At present, the main pressure-sensitive chip manufacturers are concentrated in European and American countries. Most of my country's pressure-sensitive chips rely on imports. [0003] Existing pressure-sensitive chips use traditional integrated circuit technology to make circuits on silicon substrates. As the core components of pressure sensors, pressure-sensitive chips are used to measure the pressure of gases, liquids, fluids and other media in various environments. Sensitive chips are generally insta...
Claims
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IPC IPC(8): G01L9/08G01L19/00
CPCG01L9/08G01L19/0092
Inventor 张小志安全珍孙泽程金玲
Owner NANHUA UNIV